Dai Nippon Printing Co., Ltd.

Masato Ushikusa

Toshihiko Takeda

Yutaka Matsumoto

Katsunari Obata

Hiroyuki Nishimura

Yoshinori Hirobe

Hideyuki Okamoto

Takashi Takekoshi

Chikao Ikenaga

Hiroki Oka

Chiaki Hatsuta

Sachiyo Matsuura

Yusuke Nakamura

Yoshinori Murata

Daigo Aoki

Isao Miyatani

A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 μm. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 μmto 50 μm. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.

Metal plate for producing vapor deposition masks, production method for metal plates, vapor deposition mask, production method for vapor deposition mask, and vapor deposition mask device comprising vapor deposition mask

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

Metal plate for manufacturing deposition mask and manufacturing method for metal plate, and deposition mask and manufacturing method for deposition mask

A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45&#xb0;&#xb1;0.2&#xb0;. The light is in at least one plane orthogonal to the surface.

Metal plate for producing vapor deposition masks, inspection method for metal plates, production method for metal plates, vapor deposition mask, vapor deposition mask device, and production method for vapor deposition masks

A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.

Deposition mask and method of manufacturing deposition mask

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Vapor deposition mask with metal plate

A deposition mask includes: a first mask having an opening formed therein; and a second mask superposed on the first mask and having a plurality of through-holes formed therein, the through-hole having a planar dimension smaller than a planar dimension of the opening; wherein: the deposition mask has a plurality of joints that join the second mask and the first mask to each other; the plurality of joints are arranged along an outer edge of the second mask; and a notch is formed at a position in the outer edge of the second mask, the position corresponding to a space between the adjacent two joints.

Deposition mask, deposition mask apparatus, manufacturing method of deposition mask, and manufacturing method of deposition mask apparatus

A vapor deposition mask device includes a vapor deposition mask having an effective region in which a plurality of first through holes is disposed, and a frame attached to the vapor deposition mask. The vapor deposition mask device includes a plurality of joint portions that joins the vapor deposition mask and the frame to each other. The plurality of joint portions is arranged along the outer edge of the vapor deposition mask. A notch is formed at a position corresponding to between two adjacent joint portions in the outer edge of the vapor deposition mask.

Deposition mask device and method of manufacturing deposition mask device

A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.

Multiple-surface imposition vapor deposition mask

Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.

Method for producing multiple-surface imposition vapor deposition mask, multiple-surface imposition vapor deposition mask obtained therefrom, and method for producing organic semiconductor element

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Tokyo, Japan

Masato Ushikusa