The Furukawa Electric Co., Ltd.

Masato Sakata

Hideaki Murata

Kazuto Ono

Satoru Zama

Yukio Kazama

Takahiro Okada

Kengo Mitose

Takeshi Aikiyo

Yoshikazu Kamei

Yoshikazu Tsuzuki

Masayuki Nakamura

Toshio Mugishima

Hitoshi Yuzawa

Toyoaki Ishibachi

An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn&#x2014;Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn&#x2014;Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Optical module and method of assembling the optical module

An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.

Optical semiconductor element package and manufacturing method thereof

An antenna device (A,) for a portable telephone includes a whip antenna (,) having a larger-diameter portion (,) formed near its upper end by means of forming. The guide ring (,) consisting essentially of a synthetic resin fits on the whip antenna (,), such that the guide ring (,) abuts against the larger-diameter portion (,) to rest at a position below the larger-diameter portion. The whip antenna (,) and the guide ring (,) are coated with a coating layer (,) consisting essentially of a synthetic resin. The coating layer (,) has a main portion (,) coating the whip antenna (,) below the guide ring (,), and a joint portion (,) coating the guide ring (,) and the larger-diameter portion (,). A helical antenna (,) is arranged such that it is electrically connected to a metal terminal (,) and is mechanically connected to the whip antenna (,) through the joint portion (,) and the metal terminal (,). The helical antenna (,) is coated with a block (,) consisting essentially of a synthetic resin.

Method of manufacturing an antenna device for portable telephone

IC socket

A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.

Optical module package and method for manufacturing the same

A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.

Package for optical semiconductor element and method for manufacturing

A method is disclosed for the production of amorphous metal tapes by rolling and cooling a molten metal stream between the contact faces of one roll and one metal belt. Tapes having controlled dimensions may be obtained.

Growing community of inventors

Utsunomiya, Japan

Masato Sakata