Murata Manufacturing Co., Ltd.

Masato Nomiya

Norio Sakai

Mitsuyoshi Nishide

Jun Urakawa

Akira Baba

Katsuya Matsumoto

Tatsuya Ueda

Satoshi Asakura

An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

Electronic component

An electronic component includes a substrate, a functional portion, external connection conductor portions, and first and second heat-conducting portions. The functional portion is located on first principal surface of the substrate and portion generates heat during operation. The external connection conductor portions are located directly on the first principal surface of the substrate or located below the first principal surface without direct contact with the substrate. The second principal surface of the substrate includes first and second regions. When viewed in plan in a thickness direction of the substrate, the first region does not overlap the functional portion, and the second region coincides with the functional portion. The first heat-conducting portion is located directly on all or a portion of the first region or located over all or a portion of the first region without direct contact with the substrate. The second heat-conducting portion is located directly on a region that is a portion of the second principal surface of the substrate and including at least a portion of the second region or located over the region without direct contact with the substrate and is discretely spaced away from the first heat-conducting portion when viewed in plan in the thickness direction of the substrate.

Electronic component and electronic component module including the same

An electronic component includes circuits that function independently of one another, and a switch electrically connected to the circuits. The electronic component includes a base body and two or more input/output terminals. The base body includes a main surface. The two or more input/output terminals are provided to the main surface of the base body, and include two first input/output terminals adjacent to each other. The switch changes one of the two first input/output terminals adjacent to each other to a hot terminal and changes the other to a ground terminal.

Electronic device

An elastic wave device includes an IDT electrode on a second main surface of an element substrate that includes a piezoelectric layer, a support layer on the second main surface and surrounding the IDT electrode, a cover member on the support layer, and routing wiring lines extending from the second main surface of the element substrate onto side surfaces of the element substrate.

Elastic wave device

An electronic component device includes first and second mount boards, and first, second, and third electronic components. The first electronic component includes a first major surface and a second major surface, and is disposed on the first mount board. The first major surface is positioned closer to the first mount board than the second major surface. The second electronic component includes a third major surface and a fourth major surface, and is disposed on the second mount board. The third major surface is positioned closer to the second mount board than the fourth major surface. The third electronic component includes a fifth major surface and a sixth major surface, and is disposed on the second mount board. The fifth major surface is positioned closer to the second mount board than the sixth major surface. The second major surface directly contacts the fourth and sixth major surfaces, or indirectly contacts the fourth and sixth major surfaces with a bonding layer interposed therebetween.

Electronic component device

An electronic component device includes an electronic component, a resin structure including the electronic component such that one main surface thereof is exposed, a through-electrode, and first and second wiring layers, in which the electronic component includes an element body, an inner electrode in the element body and connected to the first and second wiring layers, and an adjustment electrode provided in an adjustment region in the element body, the first wiring layer is continuously provided on the inner electrode, the adjustment region, and the resin structure, and a thermal expansion coefficient of the resin structure, a thermal expansion coefficient of the adjustment region, and a thermal expansion coefficient of the inner electrode satisfy an expression of the thermal expansion coefficient of the resin structure&#x2264;the thermal expansion coefficient of the adjustment region&#x2264;the thermal expansion coefficient of the inner electrode.

Electronic component device, high-frequency front end circuit, and communication device

The electronic component of this invention includes a multilayer ceramic substratecomposed of a plurality of ceramic layers. A wiring electrodeand a planar electrodeare formed on a ceramic layer, which is an insulating layer. The planar electrodeis formed so as to be spaced apart from the wiring electrodeat the certain interval. An edge portionis formed in a region of the planar electrodeadjacent to and spaced apart from the wiring electrodeat a certain interval. A central portionis formed in a region of the planar electrodeother than the edge portion. At least the composition of the central portionis different from the composition of the wiring electrode, and the composition of the edge portionis the same as the composition of the wiring electrode

Electronic component and manufacturing method therefor

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.

Multilayer ceramic electronic device and method for manufacturing the same

A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic material layers and the constraining layers that are alternately stacked. In the material layer, a via-hole conductor is connected to an intermediate conductor pattern. An extended portion is defined by extending an end of the via-hole conductor beyond the intermediate conductor pattern inside the basic material layer.

Multilayer wiring board

A ceramic multilayer substrate in which cracks resulting from the difference in shrinkage caused by heat or thermal shrinkage caused by firing can be prevented effectively between an end surface electrode and a substrate main body. The substrate main body includes alternately stacked first and second ceramic layers, and including first recesses provided in end surfaces of at least two adjacent ceramic layers so as to communicate with each other, and an electroconductive end surface electrode is disposed in the first recesses in the substrate main body. The first and the second ceramic layer each have a sintering start temperature and a sintering end temperature, and at least one of the sintering start temperature and the sintering end temperature is different between the first and the second ceramic layer. The substrate main body has a second recess in at least one of the ceramic layers having the first recesses so as to communicate with the first recess and lie between other ceramic layers. In the second recess, an electroconductive protrusion connected to the end surface electrode is disposed.

Ceramic multilayer substrate

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly is prepared that includes laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device, and the resin is cured.

Method for manufacturing multilayer ceramic electronic device

A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.

Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component

In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is increased. After a laminate of a multilayer ceramic substrate is formed from first ceramic layers and second shrinkage suppressing ceramic layers, and an underlayer is formed along one primary surface of the multilayer ceramic substrate, an external conductive film is formed on the underlayer. A non-sintering ceramic material powder in a non-sintered state is included in both the external conductive film and the underlayer, and this non-sintering ceramic material powder is fixed due to diffusion of a glass component from the first ceramic layers.

Multilayer ceramic substrate and method for manufacturing the same

A ceramic multilayer substrate exhibiting reduced pealing and breakage of an internal conductor disposed between a ceramic layer serving as a base member and a ceramic layer for restricting shrinkage includes a first ceramic layer, a second ceramic layerlaminated so as to come into contact with a principal surface of the first ceramic layer, and an internal conductordisposed between the first ceramic layerand the second ceramic layer, a phosphorus component layeris disposed in the first ceramic layerwith a concentration gradient in which the concentration decreases in a direction away from the internal conductor

Ceramic multilayer substrate and method for manufacturing the same

In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A semiconductor element is mounted as the surface mounting-type electronic component on the pedestal portion.

Growing community of inventors

Moriyama, Japan

Masato Nomiya