Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Kyocera Document Solutions Inc.

Kyocera Corporation

Masato Mori

Yoshihiko Yagi

Akio Furusawa

Kiyohiro Hine

Taichi Nakamura

Kei Toyota

Shinnosuke Akiyama

Yasuhiro Suzuki

Masahiro Ono

Daisuke Sakurai

Yoshihiro Tomura

Yasushi Nakagiri

Daido Komyoji

Koichi Nagai

Kunio Hibino

Naomichi Ohashi

Hirohisa Hino

Akihiro Miyashita

Shigeaki Sakatani

Osamu Uchida

Hiroshi Sakurai

Naomi Nishiki

Hidetoshi Kitaura

Hiroaki Onishi

Hidenobu Nishikawa

Shozo Ochi

Masato Hirano

Kiyoshi Nakanishi

Yuki Yoshioka

Riho Moriyama

Ryou Kuwabara

Kazuki Ono

Motonori Shimamura

Takuya Miyamoto

Sho Bunno

Kunio Sakurai

Akihiko Odani

Toyota Kei

An interference determination device includes a controller that determines interference between a robot and an object. The controller obtains a plurality of vertices of at least one object within a motion range of the robot in a real space and positional information regarding the plurality of vertices. The controller determines interference between the robot and the object in the real space on a basis of the plurality of vertices and the positional information.

Interference determination device, robot control system, and method for determining interference

A heat sink includes a graphite plate, two base materials each of which is disposed adjacent to the graphite plate, and a fixing member, in which the graphite plate has a strip shape and includes a fin portion and a base portion provided at one end of the fin portion, the base material includes a hole into which the fixing member can be inserted, the fixing member is inserted into the holes of the two base materials so that the two base materials are disposed to be adjacent to both sides of the base portion in a thickness direction, the base portion is in close contact with the base material adjacent to each other on both sides of the base portion in the thickness direction, the adjacent base materials are crimped and fixed by the fixing member in a state of being in close contact with each other, and in a case where a surface roughness of the fin portion is defined as Ra1, a surface roughness of the base material is defined as Ra2, and a surface roughness of the base portion is defined as Ra3, a relationship of Ra1&#x3e;Ra2&#x2265;Ra3 is satisfied.

Heat sink and method of manufacturing the same

A phosphor according to the present disclosure has excellent light emission properties in a blue-green region and high color rendering properties. The phosphor is represented by a chemical formula of LuMgZnAlO:Ce, in which when z is in a range of 0.01&#x2264;z&#x2264;0.03, then 0&#x2264;x&#x2264;1.4 and 0&#x2264;y&#x2264;1.4, excluding x=0 and y=0; when z is in a range of is 0.03&#x3c;z&#x2264;0.06, then y&#x3c;0.2 and 0.1&#x2264;x&#x2264;1.4, or x&#x3c;0.2 and 0.1&#x2264;y&#x2264;1.4, or x=0.2 and y=0.2; when z is in a range of 0.06&#x3c;z&#x2264;0.09, then y&#x3c;0.2 and 0.1&#x2264;x&#x3c;1.4, or x&#x3c;0.2 and 0.1&#x2264;y&#x3c;1.4; and when z is in a range of 0.09&#x3c;z&#x2264;0.12, then y&#x3c;0.2 and 0.1&#x2264;x&#x3c;0.9, or x&#x3c;0.2 and 0.1&#x2264;y&#x3c;0.9.

Phosphor and semiconductor light emitting device using the same

A phosphor has a plate-shaped phosphor, a joining-member, and a light collecting optical member. The light collecting optical member has at least one convex surface and is fixed to the plate-shaped phosphor by the joining-member. The joining-member forms a fillet shape between a surface of the plate-shaped phosphor to which the light collecting optical member is joined and a convex surface of the light collecting optical member. In a case where a height of the fillet shape from the surface of the plate-shaped phosphor to which the light collecting optical member is joined is set as a height X and a maximum distance of the light collecting optical member from the surface of the plate-shaped phosphor to which the light collecting optical member of is joined is set as a maximum distance Y, the height X is equal to or less than &#x2154; of the maximum distance Y.

Phosphor and method for producing same

An image forming apparatus includes a fixing device, a controller, and a storage. The fixing device includes a fixing part that fixes a toner image on a sheet, a heating part that heats the fixing part, and a detecting part that detects an actual temperature of the fixing part. The controller controls the actual temperature of the fixing part based on a target temperature of the fixing part and a cumulative deviation of the actual temperature of the fixing part. The storage stores a convergence value of the cumulative deviation. Every time a heating operation to the fixing part by the heating part is executed, the controller updates the convergence value of the cumulative deviation stored in the storage by a convergence value of the cumulative deviation of a latest heating operation.

Image forming apparatus controlling actual temperature of fixing part based on target temperature and cumulative deviation of actual temperature

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Resin fluxed solder paste, and mount structure

A light emitting element includes a light emitting member that is formed of at least two kinds of an oxide material and has a plate shape; and a light transmitting member that collimates a light emitted from the light emitting member and has a plano-convex shape, in which a contact portion between the light transmitting member and the light emitting member is continuous.

Light emitting element

A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.

Mounting structure and BGA ball

An image processing system includes a portable terminal and an image processing apparatus. The portable terminal includes a transmission processing unit that transmits each of the image data in units of the page of the document. The image processing apparatus includes a reception processing unit, a determination processing unit, and an output processing unit. The reception processing unit receives each of the image data in units of the page of the document transmitted from the portable terminal. The determination processing unit determines a page sequence of each of the image data in units of the page of the document based on each of the image data in units of the page of the document received by the reception processing unit. The output processing unit outputs each of the image data in units of the page of the document received by the reception processing unit in accordance with the page sequence.

Printer-end page sequencing of document pages multipage-captured by portal terminal

A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

Mounting structure and method for producing mounting structure

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3&#x2266;[Ag]&#x2266;4.0, Bi satisfying 0&#x2266;[Bi]&#x2266;1.0, and Cu satisfying 0&#x3c;[Cu]&#x2266;1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 0&#x3c;[Cu]&#x3c;0.5, In in a range of 5.2+(6&#x2212;(1.55&#xd7;[Cu]+4.428))&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 0.5&#x2266;[Cu]&#x2266;1.0, In in a range of 5.2&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 1.0&#x3c;[Cu]&#x2266;1.2. A balance includes only not less than 87 mass % of Sn.

Solder material and bonded structure

An image forming apparatus has a communication unit that receives a print job from an execution request source computer, a printing unit that executes the print job, a controller, and a storage. The storage stores route information. The controller identifies the execution request source computer, determines a movement route along which a user moves from the execution request source computer to the image forming apparatus, and sets printing speed of the printing unit lower the longer the determined movement route.

Image forming apparatus with settable printing speed and image formation system

The present invention has an aspect to provide a mounted structure of which heat-resistant fatigue characteristic is improved. A mounted structure is provided with a substrate having a substrate electrode, an electronic component having a component electrode, and a bonding part bonding the substrate electrode and the component electrode, wherein the bonding part is constituted by a solder reinforcing part and a solder bonding part, the solder reinforcing part is a side vicinity part of the bonding part, and is constituted by In of 3 wt % or more and 8 wt % or less and Sn of 88 wt % or more, and the solder bonding part is constituted by a Sn&#x2014;Bi system solder material and In of 0 wt % or more and less than 3 wt %.

Mounted structure and manufacturing method of mounted structure

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3&#x2266;[Ag]&#x2266;4.0, Bi satisfying 0&#x2266;[Bi]&#x2266;1.0, and Cu satisfying 0&#x2266;[Cu]&#x2266;1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 0&#x3c;[Cu]&#x3c;0.5, In in a range of 5.2+(6&#x2212;(1.55&#xd7;[Cu]+4.428))&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 0.5&#x2266;[Cu]&#x2266;1.0, In in a range of 5.2&#x2266;[In]&#x2266;6.8 when [Cu] falls within a range of 1.0&#x3c;[Cu]&#x2266;1.2. A balance includes only not less than 87 mass % of Sn.

When a cleaning operation is performed, a controller of an image forming apparatus controls to emit a light beam from a light emitting window so as to form a stripe image in a predetermined position of an intermediate transfer member so as to form a image defect part in the stripe image, which occurs when a cleaning member moving in a reciprocating manner in a main scanning direction along the light emitting window blocks the light beam. In addition, the controller detects the image defect part by a density detecting member. When a predetermined number of image defect parts are not formed in the predetermined position in the period from start to end of the cleaning operation, the controller determines that the cleaning member is within the scanning range of the light beam.

Growing community of inventors

Osaka, Japan

Masato Mori