Tokyo Electron Limited

Masato Mizuta

Koji Takayanagi

Tatsuya Kawaji

Keigo Nakano

A substrate heating device includes: heating modules each having a processing vessel within which a heating plate is disposed, an gas inlet port for introducing a purge gas into a processing atmosphere, and an exhaust port for exhausting the processing atmosphere; individual exhaust paths each connected to the exhaust port of the heating modules; a common exhaust path connected to downstream ends of the individual exhaust paths of the heating modules; a branch path branched from the individual exhaust paths and opened to the outside of the processing vessel; and an exhaust flow rate adjusting unit configured to adjust a flow rate ratio of an exhaust flow rate of a gas exhausted from the exhaust port into the common exhaust path and an introduction flow rate of a gas introduced from the outside of the processing vessel into the common exhaust path through the branch path.

Substrate heating method

Disclosed is a heat treatment apparatus for performing a heat treatment on a coating film formed on a substrate. The apparatus includes a placing unit provided within a processing container, and configured to place the substrate thereon; a heating unit configured to heat the substrate placed on the placing unit; a gas supply port provided along a circumferential direction outside the substrate on the placing unit in a plan view, and configured to supply gas into the processing container; an outer circumferential exhaust port provided along the circumferential direction outside the substrate on the placing unit in a plan view, and configured to exhaust an inside of the processing container; and a central exhaust port provided above a central portion of the substrate on the placing unit, and configured to exhaust the inside of the processing container.

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Koshi, Japan

Masato Mizuta