Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Resonac Corporation

Masato Miyatake

Tomohiko Kotake

Hikari Murai

Hiroyuki Izumi

Shin Takanezawa

Shunsuke Nagai

Chisato Kikkawa

Tatsuya Makino

Shintaro Hashimoto

Shinji Tsuchikawa

Yasuo Inoue

Nozomu Takano

Tomio Fukuda

Satoshi Takayasu

Toshinori Makuta

Koutarou Kadoya

Shinichiro Abe

Atsushi Takahashi

Tomoaki Shibata

Yasuo Kamigata

Yoshihiro Takahashi

Masatoshi Yamaguchi

Tetsurou Irino

Masahiro Aoshima

Kouta Iwanaga

Yuta Akasu

Masahisa Ose

A method for producing an aerogel composite includes drying a wet gel generated from a sol comprising a silica particles, and at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group in a molecule, and a hydrolysis product of the silicon compound.

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

A production method for an aerogel laminate includes a step of preparing a sol of producing a sol for forming an aerogel, an applying step of applying the sol obtained in the step of preparing a sol to a support having a heat ray reflective function or a heat ray absorbing function, and drying the sol to form an aerogel layer, an aging step of aging the aerogel layer obtained in the applying step, a washing step of washing the aged aerogel layer and performing solvent exchange, and a drying step of drying the aerogel layer washed in the washing step.

Aerogel laminate and thermal insulation material

The present invention relates to an aerogel composite powder superior in thermal insulation and flexibility, the aerogel composite powder comprising an aerogel component and a silica particle.

Aerogel composite powder

A sol composition for aerogel formation including a hydrolysis product of a polysiloxane compound.

Sol composition

An aerogel laminate roll is prepared by winding an aerogel laminate around a roll core, the aerogel laminate comprising a support and an aerogel layer disposed on the support and having a thickness of 200 &#x3bc;m or less.

Production method for aerogel laminate, and aerogel laminate roll

The present invention relates to a sol composition for forming an aerogel composite, wherein the sol composition is a sol composition with a sufficient pot life for forming an aerogel composite superior in thermal insulation and flexibility, and comprises: at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group or a condensable functional group and a hydrolysis product of the silicon compound having a hydrolyzable functional group; and a silica particle having an average primary particle diameter of 5 to 300 nm or a specific surface area of 10 to 600 m/g.

Sol composition, aerogel composite, support member provided with aerogel composite, and heat insulator

The present invention relates to an aerogel laminated composite having a structure in which a porous spacer layer, an aerogel layer and a support having a heat ray reflective function or a heat ray absorbing function are laminated in this order.

Aerogel laminated composite and thermal insulation material

The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m&#xb7;K or less and a compressive elasticity modulus of 2 MPa or less at 25&#xb0; C. under atmospheric pressure.

Aerogel

The invention relates to an aerogel composite comprising an aerogel component and a silica particle, and being superior in thermal insulation properties and flexibility.

The present invention relates to a production method for an aerogel laminate including a support, and an aerogel layer disposed on the support and having a thickness of 200 &#x3bc;m or less, the method comprising a step of washing a wet gel laminate including the support and a wet gel layer disposed on the support by a roll-to-roll scheme.

A sugar alcohol microcapsule obtained by mixing particles that include molten sugar alcohol and are dispersed in an oil phase with a material that reacts with the particles, and encapsulating the sugar alcohol.

Sugar alcohol microcapsule, slurry, and resin molded article

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein Rand Rindependently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein Rand Rindependently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

Growing community of inventors

Tokyo, Japan

Masato Miyatake