Ibiden Company Limited

Masato Kawade

Motoo Asai

Yasuji Hiramatsu

Yoichiro Kawamura

Toshihiko Yasue

Hideki Yano

Yoshifumi Ishitani

Ayumi Suzuki

Hideki Murase

Kouta Noda

Yoshitaka Ono

Youko Nishiwaki

Shinji Hiratuka

Hiroaki Uno

Printed circuit board suitable for the high densification of mounting parts using a solder bump and having improved connection and mounting reliability, wherein the printed circuit board includes a mounting pad provided with a solder bump by covering the mounting surface with a solder resist, and a position of forming the solder bump is arranged so as to match with a position of the viahole, or a size of the opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not be overlap the solder resist with the viahole.

Printed circuit boards

This invention is to provide a printed circuit board suitable for the high densification of mounting parts using a solder bump and for the improvements of connection reliability and mounting reliability, and proposes a printed circuit board comprising a mounting pad provided with a solder bump by covering a mounting surface with a solder resist, characterized in that a position of forming the solder bump is arranged so as to match with a position of a viahole, or a size of opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not to overlap the solder resist with the viahole.

The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board

It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.

Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board

Multilayer printed circuit board, method of producing multilayer printed

Multilayer printed circuit board and method of producing the same

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Gifu, Japan

Masato Kawade