Hitachi, Ltd.

Hitachi Techno Engineering Co., Ltd.

Masato Itagaki

Susumu Nakayama

Haruo Mishina

Katsuaki Kikuchi

Keisuke Fujishiro

Yoshio Haeda

Tetsuya Arata

Fumio Harada

Masahumi Wada

Yosio Haeda

Akira Murayama

Masakatsu Hayashi

Teruo Umehara

Housei Higashi

Sigeaki Kuroda

Shinya Yamama

Makoto Nagai

Masamichi Hanada

Takashi Kawakami

Yasuro Ohishi

Masamichi Tomita

Koh Tsuji

Eiji Maeda

Hironori Etou

Masahisa Sofue

Fumihiko Kitani

Mituo Fukuda

Masafumi Wada

Isamu Horiuchi

Yutaka Mori

Kimito Kasukabe

Yuji Tsujita

There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.

Reflow soldering apparatus for soldering electronic parts to circuit

A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer. A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.

Reflow soldering apparatus

In a method and a system in which while carrying objects to be treated to a preheating chamber and a reflow chamber adjacent thereto, hot gases are blown against the objects to be treated by cross flow blowers provided in the preheating chamber and the reflow chamber to melt solder so as to solder electronic parts on a circuit substrate; a free air introducing port is controllably provided in the vicinity of an intake port of the cross flow blower in the preheating chamber, and an exhaust port and an exhaust fan for exhausting gases having an amount corresponding to the free air taken from the free air introducing port, out of the preheating chamber are provided.

Reflow soldering method and system therefor

A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as heated air is uniformly applied to the object such as a combination of a substrate and an electronic parts carried by the substrate, whereby uniform distributions of temperature and flow velocity of the hot gas are attained. The hot gas recirculation means may be arranged so as to vary the angle at which the hot gas impinges upon the substrate and the breadth over which the hot gas is applied.

The present invention consists in that printed patterns on a printed circuit board and component information near the printed patterns are photographed, that the type of an electronic component to be mounted and the mounting position and mounting attitude of the electronic component are recognized from the photographed image, and that the predetermined electronic component is mounted on the predetermined position of the printed circuit board at the predetermined attitude on the basis of the above information items. Further, a program for the mounting order of all the electronic components to be mounted on the printed circuit board is generated on the basis of the image processing information items.

Apparatus for and method of mounting electronic components

An electronic parts mounting device roughly turns a mounting head to which an electronic part is sucked in multiple actions in a plurality of steps in accordance with the direction in which the electronic part is to be mounted. Then, the attitude of the electronic part is detected and the mounting head is precisely turned in accordance with the results of the detection so as to correct the attitude of the electronic part so that the electronic part can be accurately mounted on a printed circuit board.

Device for mounting electronic parts

An electric parts mounting apparatus is provided with a head rotation drive mechanism which is magnetically or fluidly connected to a vacuum head in a non-contact state. The vacuum heads are rotated by the head rotation drive mechanism, and the electric parts taken up by the vacuum heads are angularly positioned, and then mounted on the circuit board.

Electric parts mounting apparatus and electric parts mounting method

In an electronic chip supplying apparatus, a vacuum suction device for sucking a retainer tape which encases electronic chips is provided in a retainer tape support member provided at an opening position where the electronic chips are picked up from a chip pickup device, or a tension applying device for the retainer is provided. Thus, vertical fluctuation of the retainer tape is prevented at the opening position.

Electronic chip supplying apparatus and method

A linear motor of moving-coil type is disclosed, in which a multi-phase moving coil includes a plurality of flat coil units each not wider than the longitudinal length of a permanent magnet making up a stationary part divided by the number of coil phases, the flat coil units being arranged successively in the same plane with central parts not adjacently overlaid one on the other. The central parts of the moving flat coil units have a thickness equivalent to a single phase in spite of the multiple phases of the moving coil. Thus a great electromagnetic force is generated, and at the same time a high propulsive force is obtained with the magnetic flux density not reduced in the gap accomodating one phase of coils alone.

Linear motor of moving-coil type

In an electronic component mounting apparatus comprises a component feeding section including a feeding table unit loaded with several types of electronic components which feeding table unit is adapted to laterally reciprocate on a base, and stopping at a predetermined position thereby to feed the components continuously to a transfer mechanism, the transfer mechanism for absorbing the electronic components and mounting them on a board on an X-Y table on the other side, the X-Y table fixing and stopping the board to a predetermined position, and a board transport section for transporting the board onto the X-Y table for delivering the board having the electronic components mounted thereon, a component feeding apparatus wherein the component feeding table unit of the component feeding section is divided into a plurality of feeding tables each adapted to be moved individually on a straight line by a drive mechanism, the apparatus further comprising means for moving the table to a predetermined position in opposed relationship with the transfer mechanism in resonse to a command from the control unit.

Components feeding apparatus

An impeller of a centrifugal blower includes a hub, a hub plate, a plurality of blades and a shroud. The hub plate has an outer diameter which is smaller than an inner diameter of the shroud and a portion of the blades existing in the difference between the diameters is provided with a parting plane of molds, whereby the impeller can be integrally molded by the injection molding.

Impeller of centrifugal blower

A hermetic motor compressor having a motor compressor unit including an upper motor section and a lower compressor section connected with each other and a closed housing accommodating therein the motor compressor unit. The compressor section includes a frame body forming a cylinder, a cylinder head provided with a discharge valve and a suction valve and a head cover in which only a discharge chamber is formed. A suction chamber of a small volume is formed in the frame body at a portion around the cylinder and is communicated with the upper part of a space in the closed housing through an upright suction pipe made of a synthetic resin.

Hermetic motor compressor

A hermetic motor compressor for compressing refrigerant gas in air conditioners or refrigerators. The hermetic motor compressor includes a motor compressor disposed in a closed housing and consisting of a motor section and a compressor section formed integrally with each other. The compressor section has a cylinder head cover, discharge silencer and discharge tube through which the compressed refrigerant gas is discharged to the outside. The cylinder head cover, discharge silencer and discharge tube are covered by heat insulating members with suitable spaces provided therearound. Heat radiation from the discharge system is therefore prevented by the spaces as well as by the heat insulating members, so that the temperature rise of refrigerant gas in the closed housing is avoided to ensure a higher volumetric efficiency of the compressor.

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Kashiwa, Japan

Masato Itagaki