Fuji Manufacturing Co., Ltd.

Masato Hinata

Keiji Mase

Daisuke Chino

To cut out a hard-brittle substrate by blasting, laying out substrateson a plate materialmade of a hard-brittle material with leaving a space for blasting; forming first protective filmson both surfaces of the plate materialat layout positions of the substrates; and forming second protective filmson both surfaces of a marginof the plate materialwith leaving a space with respect to the first protective filmsand having outer edges from a periphery of the plate materialat a width of 5 mm or less; cutting regionsbetween the filmsand between the filmsfrom one surface of the plate materialto a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate materialuntil the plate materialis penetrated.

Method and device for cutting out hard-brittle substrate

To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 &#x3bc;m and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm and an ejection pressure of 0.2 MPa to 0.6 MPa without masking so that 0.25 cmor less of the abrasive is included per 1000 cmof the compressed gas discharged from the ejection nozzle.

Blasting machine for scribing

To cut out a hard-brittle substrate by blasting, laying out substrateson a plate materialmade of a hard-brittle material with leaving a space for blasting; forming first protective filmson both surfaces of the plate materialat layout positions of the substratesand forming second protective filmson both surfaces of a marginof the plate materialwith leaving a space with respect to the first protective filmsand having outer edges from a periphery of the plate materialat a width of 5 mm or less; cutting regionsbetween the filmsand between the filmsfrom one surface of the plate materialto a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate materialuntil the plate materialis penetrated.

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Tokyo, Japan

Masato Hinata