Murata Manufacturing Co., Ltd.

Masato Higuchi

Michinobu Maesaka

Tatsuo Kunishi

Masanori Endo

Tetsuo Tatsumi

Kouichi Watanabe

Hideki Shinkai

Atsushi Hirakawa

Koichi Kanryo

Nobushige Araki

Osamu Ishikawa

Shinobu Uesugi

A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.

Manufacturing method of electronic component

A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.

Method of producing piezoelectric component and piezoelectric component

A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.

Method and device for applying sealant to component

A surface acoustic wave device includes a surface acoustic wave element and a package. The package has a base member and a conductive cap member which are joined together by a sealing material so as to hermetically seal the surface acoustic wave element therein. The conductive cap member is coated with the sealing material on the entire surface thereof that is disposed opposite to the base member.

Surface acoustic wave device having a package including a conductive cap that is coated with sealing material

An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer having holes formed therein so as to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.

Electronic component

An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.

A plurality of flat power supply elements, each having a flat case for serving as an element terminal and an electrode plate arranged in the case in a close contact manner through an insulating layer for serving as another element terminal. An opening formed in the case for partially exposing the electrode plate. The flat power supply elements are bonded onto a flexible circuit board by an insulating bonding layer. A first external connection terminal which is provided on the circuit board is connected to the electrode plate of one power supply element through a first conductive member. A connecting conductor which is also provided on the circuit board is electrically connected to the case of this one power supply element through a second conductive member and connected to the electrode plate of another power supply element through a third conductive member. A second external connection terminal which is provided on the circuit board is electrically connected to the case of this another power supply element through a fourth conductive member. Thus, a plurality of flat power supply elements having excellent sealing structures are combined with each other to provide an integrated thin power supply unit with no increase in thickness.

Thin power supply unit

A stacked electric double layer capacitor including a peripheral portion of an intermediate electrode plate held between peripheral portions of first and second case halves to be welded to each other, thereby defining first and second closed spaces for storing first and second capacitor elements, respectively. The first and second electrode plates are exposed by openings provided in the first and second case halves to form external terminal means, respectively. The two capacitor elements, stacked in series with each other are stored in the case, formed by joining the case halves to form a stacked electric double layer capacitor which can be reduced in thickness with substantially no leakage of electrolyte.

Growing community of inventors

Kanazawa, Japan

Masato Higuchi