Nichia Corporation

Masato Fujitomo

Hiroto Tamaki

Tomohide Miki

Yuichiro Tanda

Shinji Nishijima

Hiroshi Miyairi

Takayuki Igarashi

Satoshi Shirahama

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Optical-semiconductor device including a wavelength converting member and method for manufacturing the same

Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same

Optical-semiconductor device and method for manufacturing the same

A light emitting device has a plurality of light emitting elements, a heat spreading member on which the plurality of light emitting elements are mounted, and having a bottom face, an insulating member having a recess that includes side walls and a bottom wall, a top face of the bottom wall being in contact with the bottom face of the heat spreading member, and a circuit board having a circuit that is provided on the heat spreading member and supplies power to the plurality of light emitting elements.

Light emitting device and lighting fixture

Growing community of inventors

Yokohama, Japan

Masato Fujitomo