Rohm Co., Ltd.

Masato Doi

Shigeru Kambara

Takahiro Kuriyama

Yoshinori Matsumoto

Hirotoshi Inoue

Hiroshi Kaida

Daisuke Saito

Susumu Okuno

Seiji Mitsuno

A chip resistor includes: an insulating chip substratehaving an upper surface formed with a resistive filmand a pair of left and right upper electrodesat two ends thereof; a cover coatcovering the resistive film; auxiliary upper electrodesformed on upper surfaces of the upper electrodesto overlap the cover coat; a left and a right side electrodesformed on a left and a right end surfacesof the insulating substrate; and metal plate layers formed on surfaces of the auxiliary upper electrodes and side electrodes. The cover coatis formed with an uppermost over coatcovering a region where the auxiliary upper electrodesoverlap the cover coat, whereby the upper electrodesand the auxiliary upper electrodesare protected from migration caused by sulfur gases.

Chip resistor and method for making the same

A chip resistor includes an insulating chip substrate, a resistor film formed on the substrate, a pair of upper electrodes formed from silver paste to be connected to the resistor film, a cover coat covering the resistor film, an auxiliary electrode formed on each of the upper electrodes to partially overlap the cover coat, a side electrode formed on each of the side surfaces of the substrate to be connected to the upper electrode and the auxiliary electrode, a nickel-plated layer covering the auxiliary electrode and the side electrode, and a soldering layer covering the nickel-plated layer. The side electrode is made from nonmagnetic conductive resin paste, whereas the auxiliary upper electrode is made from carbon-based conductive resin paste.

Chip resistor

A chip resistor includes an insulating substratein the form of a chip having an upper surface and an opposite pair of side surfaces, a resistor filmformed on the upper surface of the insulating substrate, a pair of upper electrodesformed on the upper surface of the insulating substrateto flank the resistor filmin electrical connection thereto, a cover coatcovering the resistor film, an auxiliary upper electrodeformed on each of the upper electrodesand including a first portionadjoining the relevant side surface of the insulating substrateand a second portionoverlapping the cover coat, and a side electrodeformed on each of the side surfaces of the insulating substrateand electrically connected to at least the upper electrodeand the auxiliary upper electrode. The first portionof the auxiliary upper electrodehas an obverse surface positioned higher than an obverse surface of the second portionfor projecting above an obverse surface of the cover coat

A chip resistor is formed with an elongated resistor connecting a pair of electrodes on a substrate and grooves are formed on the surface of the resistor in a characteristic pattern having a longer branch and a shorter branch. The longer branch may be L-shaped, extending between a selected point on a side edge of the resistor and an end point which is nearer towards one of the electrodes. The shorter branch extends between another point on the side edge of the resistor and an intermediate point on the longer branch other than the end point. To form the grooves in such a pattern, the longer branch is formed first by laser-trimming from the side edge of the resistor to the end point. The laser is then switched off and is moved to the intermediate branching point along the branch of the groove just formed. The shorter branch is then formed by switching on the laser and moving it from the branching point to the other end.

Method of laser-trimming for chip resistors

A resistor chip has a pair of mutually separated upper-surface electrodes on the upper surface of an electrically insulating substrate in a form of a chip, an resistor film having end portions which are each over a corresponding one of these upper-surface electrodes, a cover coating made of a glass material which is over a portion of this resistor film, and a pair of plated metallic layers each over a corresponding one of end surfaces of the substrate. Edge sections of the insulator film over the upper-surface electrodes are not covered by the cover coating and are each directly covered by one of these plated metallic layers.

Resistor chip

In a chip type resistor, a middle coat which is a component of a cover coat has extensions or enclaves formed at portions on a surface of main upper electrodes of terminal electrodes. Auxiliary upper electrodes of terminal electrodes are formed extending over both the surface of extensions or enclaves of middle coat and the surface of main upper electrodes. Therefore, the step between the surface of terminal electrodes at opposing ends of resistive film and the surface of cover coat for the resistive film can be reduced or eliminated with low cost.

Chip type resistor

Disclosed is a chip network electronic component prevents a short circuit between adjacent electrodes upon soldering, and the strength of the projecting portion is increased to improve reliability. The chip network electronic component includes an insulator substrate having recessed portions in opposite side surfaces to have a plurality of pairs of projecting portions. Electrodes are formed respectively at the projecting portions so as to extend from a main surface to a back surface of the substrate. Electrical elements are each formed on the main surface of the substrate to electrically connect between one pair of the electrodes. A coating layer covers a surface of the electrical elements. The recessed portion includes a pair of opposite flat planes and a flat-planed bottom connecting between the flat planes. The flat plane and the bottom has a connecting portion formed therebetween to have a curvature of 0.1 mm or greater.

Chip network electronic component

Chip-type composite electronic component

A chip resistor is provided which comprises: an electrically insulating substrate chip having a top surface, an opposite pair of end faces, and an opposite pair of side faces; a resistor element formed on the top surface of the chip intermediate the end faces of the chip; a coating for covering the resistor element; a spaced pair of main electrodes formed on the top surface of the chip adjacent to the respective end faces of the chip in conduction with the resistor element; a spaced pair of auxiliary electrodes formed on the respective main electrodes; a pair of end electrodes formed on the respective end faces of the chip in conduction with the main and auxiliary electrodes; and a metallic plating formed on the auxiliary and end electrodes. Each of the main and auxiliary electrodes is spaced inwardly from the respective side faces of the chip.

Growing community of inventors

Kyoto, Japan

Masato Doi