Sony Corporation

Konica Corporation

Isuzu Motors Limited

Sony Semiconductor Solutions Corporation

Konica-minolta Holdings, Inc.

Masato Doi

Toyoharu Oohata

Hiroyuki Okuyama

Goshi Biwa

Osamu Matsuda

Hironobu Narui

Tomoyuki Kikutani

Katsuhiro Tomoda

Jun Suzuki

Kenji Sahara

Toshiaki Iwafuchi

Toshihiko Watanabe

Katsushi Fujita

Kazuhiko Nemoto

Hideharu Nakajima

Etsuo Morita

Toshiya Takagishi

Toshiaki Kanemitsu

Yousuke Murakami

Masaru Fujii

Izushi Kobayashi

Hisashi Kadota

Tsutomu Yoneyama

Yasuaki Tamakoshi

Nobuaki Sato

Minori Higuchi

Kazuhiro Nishi

Hiroshi Terahara

Hendrik Sabert

Takashi Nakao

Masakazu Ukita

Yoshihide Hoshino

Akiyoshi Aoyagi

Makoto Natori

Kazuo Honda

Naoki Hirao

Toshimasa Kobayashi

Katsutoshi Sawada

Masaru Minami

Yasuhiko Muramatsu

Junichi Tamura

Yoichi Ohshige

Takao Kubota

Mitsuharu Kitamura

Kensuke Kojima

Hidehiro Kawaguchi

Shoichi Muraguchi

Miyuki Hosoi

Yuji Nishi

Hiroshi Ichikawa

Toshiyuki Yamamoto

Yoshinobu Higuchi

Tohru Hoshino

Hiroaki Tajima

Tsuyoshi Sugita

Etsuo Kamijo

Masanobu Tomomura

A display device includes a first substrate, a second substrate, and a plurality of light emitting sections. The first substrate includes a first surface and a second surface which faces the first surface. The second substrate is arranged to face the first substrate, and is configured with a first surface which faces the second surface of the first substrate, and a second surface which faces the first surface. The plurality of light emitting sections is provided on the second surface of the first substrate while being separated from the second substrate. A light transmission suppression layer on which a light transmission section to transmit light from light emitting sections is provided is formed on the second surface of the second substrate in correspondence to each light emitting section. An anti-reflection layer is formed in the light transmission section.

Display device

A mounting substrate includes: a wiring substrate; and a plurality of optical elements mounted on a mounting surface of the wiring substrate, and each having a first electrode and a second electrode. The wiring substrate includes a support substrate, a plurality of first wires, and a plurality of second wires. The first wires and the second wires are provided within a layer between the support substrate and the mounting surface. The first wires are electrically connected with the first electrodes. The second wires are electrically connected with the second electrodes, and each have cross-sectional area larger than cross-sectional area of each of the first wires.

Mounting substrate and optical unit

A crystal foundation having dislocations is used to obtain a crystal film of low dislocation density, a crystal substrate, and a semiconductor device. One side of a growth substrate () is provided with a crystal layer () with a buffer layer () in between. The crystal layer () has spaces (), () in an end of each threading dislocation Delongating from below. The threading dislocation Dis separated from the upper layer by the spaces (), (), so that each threading dislocation Dis blocked from propagating to the upper layer. When the displacement of the threading dislocation Dexpressed by Burgers vector is preserved to develop another dislocation, the spaces (), () vary the direction of its displacement. As a result, the upper layer above the spaces (), () turns crystalline with a low dislocation density.

Crystal film, crystal substrate, and semiconductor device

A manufacturing method of a display device, includes: a first step of collectively transferring light-emitting elements arranged at every specified number of light-emitting elements formed and arranged on a first substrate to a transfer area set on a second substrate; and a second step of transferring light-emitting elements remaining on the first substrate to between the plural light-emitting elements mounted on the second substrate in at least one of a state where the first substrate is moved with respect to the transfer area on the second substrate and a state where the first substrate is rotated in a plane.

Manufacturing method of display device and display device

A method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.

Method of producing image display unit

A display device for displaying an image using matrix driving includes: an emission element corresponding to each pixel to be displayed, disposed on L lines, with the scanning direction as lines; a display portion whereby the M lines worth of the emission elements are simultaneously driven; and a connection unit for connecting an on-substrate wiring line extracted from the emission element of the display portion externally; with the connection units including connection terminals for connecting each of the on-substrate wiring lines externally, and at least a part of the connection terminals being arrayed two-dimensionally so as to make up M columns; and with each of the M columns worth of the connection terminals being connected with the on-substrate wiring lines which are thinned out (M&#x2212;1) wiring lines at a time.

Display device and wiring routing method

A device transfer method and a display apparatus are provided. A device transfer method and a display apparatus are provided by or in which, in transferring devices arranged on a substrate onto another substrate, it is possible to easily strip the substrate after the transfer of the devices, to lower the possibility of damaging of the substrate, and to additionally transfer devices onto the same substrate after the transfer of the devices. A plurality of devices arranged on a temporary holding substrate are embedded into and held in a pressure sensitive adhesive layer formed on a transfer substrate, and the devices are stripped from the temporary holding substrate. Other devices are further additionally embedded into the pressure sensitive adhesive layer before hardening the pressure sensitive adhesive layer, whereby the devices can be arranged on a transfer substrate having a large area. Besides, where the devices additionally embedded into the pressure sensitive adhesive layer are different in characteristics from the devices embedded in the pressure sensitive adhesive layer in advance, it is possible to easily obtain a display apparatus for multicolor display, a display apparatus having a driving circuit, and the like.

Device transfer method and display apparatus

Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer, which is made of a material whose viscosity can be controlled, on a substrate; controlling the viscosity of a first partof the element holding layer, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second partof the element holding layeroutside the first partinto a viscosity making the element naturally immovable; and after mounting one elementin the first part, controlling the viscosity of the first partinto the viscosity making the elementnaturally immovable.

Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display

A semiconductor light-emitting device is provided. In an InGaN-based semiconductor light-emitting device including an Ag electrode, a semiconductor layer on the contact side of at least the Ag electrode is a dislocation semiconductor layer of which dislocation density is selected to be less than 1&#xd7;10) and thereby short-circuit caused by Ag migration generated along this dislocation can be avoided. Thus, this semiconductor light-emitting device is able to solve a problem of a shortened life and a problem with the fraction of defective devices encountered with the InGaN-based semiconductor light-emitting device.

Semiconductor light-emitting device

An image display unit and a method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.

Image display unit with light emitting devices having a resin surrounding the light emitting devices

A method of forming a wiring of a light emitting device having an electrode on a light emission surface is disclosed. The method includes: forming the electrode nearly in a linear shape in which the width is narrower than the light emission surface; and forming a wiring that is connected to the electrode nearly in a linear shape in which the width is narrower than the light emission surface to cross the electrode.

Method of forming wiring of light emitting device, substrate for mounting light emitting device, display, back light, illuminating apparatus and electronic appliance

Image display unit

Light-emitting devices, light-emitting apparatuses, image display apparatuses and methods of manufacturing same are provided. The devices and apparatuses include a transparent electrode that is connected directly to light output surfaces so as to cover the whole areas of the light output surfaces. The transparent electrode is formed to be larger in area than the light output surfaces, and are securely electrically connected to n-type semiconductor layers including the light output surfaces.

Light-emitting device, light-emitting apparatus, image display apparatus, method of manufacturing light-emitting device, and method of manufacturing image display apparatus

A method for manufacturing a light-emitting diode display is provided. The method includes pre-fixing first, second, and third light-emitting diodes on a light emitting unit production substrate to produce light-emitting units each including first, second, and third light-emitting diodes, first electrodes of the first, second, and third light-emitting diodes being connected to a sub-common electrode. The method also includes transferring and fixing the light-emitting units from the light-emitting unit production substrate to a display substrate to produce a light-emitting diode display including the light-emitting units which are arranged in a first direction and a second direction perpendicular to the first direction (i.e., arranged in a two-dimensional matrix).

Light-emitting diode display and method for manufacturing the same

Growing community of inventors

Kanagawa, Japan

Masato Doi