Tokyo Electron Limited

Masatake Yoneda

Shigeru Kasai

Masahiro Shimizu

Sumi Tanaka

Hiroyuki Miyashita

Tomohiro Suzuki

Kazuhiro Ooya

Naoki Shindo

Ayuta Suzuki

Ikuo Sawada

Masamichi Nomura

Tomonao Kuwada

Miwa Shimizu

Takashi Nishimori

Disclosed is a liquid processing apparatus that processes a substrate with a processing liquid. The processing apparatus includes: a substrate holder configured to hold the substrate; a processing liquid supply unit configured to supply the processing liquid to the substrate held by the substrate holder; a rinsing liquid supply unit configured to supply a rinsing liquid to the substrate; and a light emitting element configured to emit light of a wavelength range, which is absorbed only by the substrate, and irradiate the emitted light to the substrate.

Liquid processing apparatus, liquid processing method, and recording medium having program for executing liquid processing method recorded therein

An annealing apparatus includes heating sources provided to face a wafer W, the heating sources having LEDs emitting lights to the wafer; light-transmitting members for transmitting the lights emitted from the LEDs; and cooling members made of aluminum and provided to directly contact with the heating sources, respectively. The heating sources include a plurality of LED arrays having supporters made of AlN, each having one surface on which the LEDs are adhered by using a silver paste; and other surface on which thermal diffusion members made of copper are adhered by using a solder. The LED arrays are fixed to the cooling member by using screws via a silicone grease.

Annealing apparatus

Disclosed is an annealing device that includes a processing chamber into which a wafer is received, a heating source having a plurality of light emitting diodes (LEDs) for emitting a light toward the wafer, which faces the surface of the wafer, and a light transmissive member provided corresponding to the heating source, into which the light from the light emitting elements is transmitted. The heating source has the light emitting elements attached on a support toward the wafer. Each of the light emitting elements is individually covered with a lens layer made of a transparent resin.

Annealing device

Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamberfor accommodating a wafer W; heating sourcesandincluding LEDsand facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting membersandarranged in alignment with the heating sourcesandto transmit the light emitted from the LEDs; cooling membersandsupporting the light-transmitting membersandat opposite side to the processing chamberto make direct contact with the heating sourcesandand made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling membersandwith a coolant.

Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the process container, a supporting table provided in the process container, a ring-shaped supporting part provided on the supporting table, a mounting plate for mounting the object to be processed and supported by the supporting part, a plurality of thermoelectric conversion elements provided on an upper plane of the supporting table on an inner side of the supporting part, an element storing space evacuating means for evacuating inside the element storing space formed by a lower surface of the mounting plate, which is supported by the supporting part, an upper plane of the supporting table and the supporting part.

Processing equipment for object to be processed

A heat treatment apparatus for performing prescribed heat treatment to a subject (W) to be treated is provided with a processing chamber in which air can be exhausted; a mounting table arranged in the processing chamber, for placing on an upper plane the subject to be treated; a plurality of thermoelectric conversion elements arranged on an upper part of the mounting table; a light transmitting window for covering a ceiling portion of the processing chamber airtight; and a gas introduction unit for introducing a required gas into the processing chamber. A heating unit which includes a plurality of heating light sources including a semiconductor light emitting element for emitting heating light to the subject to be treated, is provided above the light transmitting window. Thus, heating efficiency is improved and temperature can be increased and reduced at a higher speed for the subject to be treated.

Heat treatment apparatus, computer program, and storage medium

The present invention provides a thermal processing apparatus that conducts a thermal process such as an annealing process at a temperature of 400&#xb0; C. or more to an object to be processed. The apparatus is provided with a processing vessel () having a transmitting window () in a top part thereof. A table () is disposed in the vessel, that supports thereon the object (W) opposed to the transmitting window. A plurality of heating lamps (A,B) are disposed above the processing vessel, that heat the object by irradiating heat rays to the object through the transmitting window. A thermoelectric converter () is disposed on the table and configured to at least cool the object. When a temperature of the object is increased, the object is mainly heated by the heat rays from the heating lamps. When the temperature of the object is decreased, the object is forcibly cooled by means of the thermoelectric converter.

Thermal processing apparatus

Processing equipment for an object to be processed is provided with a process container, the internal of which can be evacuated, a gas introducing means for introducing a prescribed gas into the process container, a supporting table provided in the process container, a ring-shaped supporting part provided on the supporting table for supporting the object to be processed, a plurality of thermoelectric conversion elements provided on an upper plane of the supporting table on an inner side of the supporting part, an element storing space evacuating means for evacuating inside the element storing space formed by a lower plane of the object to be treated, which is supported by the supporting part, an upper plane of the supporting table and the supporting part.

There is disclosed a shower head structure, disposed on a ceiling portion of a process chamber for subjecting a material to be treated to a film forming process, for supplying a predetermined gas, the structure comprising a head main body formed in a cup shape having a bottom with a plurality of gas injection holes opened therein, and formed integrally with a joining flange portion to be attached to the ceiling portion of the process chamber on an opening side of the cup shape, and a head heating portion, disposed on the bottom of the head main body, for adjusting the head main body at a desired temperature, so that the film forming process for enhancing reproducibility under a low temperature is performed and a reactive byproduct is removed under a high temperature.

Shower head structure and cleaning method thereof

A film deposition apparatus of the present invention includes a container forming a processing chamber for processing a target object, a mounting table which is provided in the processing chamber and on which the target object is mounted, a first heating apparatus provided in the mounting table, for heating the target object mounted on the mounting table, a first gas supply section provided in the container, for supplying processing gas into the processing chamber, the processing gas forming a high-melting-point metal-film layer on the target object mounted on the mounting table, a movable clamp for clamping a periphery of the target object and holding the target object on the mounting table, a second heating apparatus formed separately from the clamp, for heating the clamp indirectly, a gas flow path formed between the clamp and the second heating apparatus when the clamp is moved to a position where the clamp clamps the target object, and a second gas supply section for causing backside gas to flow into the gas flow path.

Growing community of inventors

Nirasaki, Japan

Masatake Yoneda