Taiyo Yuden Co., Ltd.

Showa Denko K.k.

Masataka Watabe

Yasutomo Suga

Takashi Shoji

Satoshi Noda

Takekazu Sakai

Takeo Kuramoto

Yuji Hoshi

Takeshi Nakajima

Yuji Tomizawa

Toshiya Kuji

Jun Nishikawa

Shota Yajima

Sadayoshi Kato

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axis direction and Trepresents a dimension of each extended portion in the first axis direction, T+Tis 50 &#x3bc;m or less, and T/(T+T) is 0.32 or less.

Multi-layer ceramic electronic component

A multi-layer ceramic electronic component includes: a ceramic body including a main surface facing in a first direction, an end surface facing in a second direction orthogonal to the first direction, a side surface facing in a third direction orthogonal to the first and second directions, and internal electrodes laminated in the first direction; and an external electrode formed on a surface of the ceramic body, the external electrode including a base film including an end-surface-covering portion that covers the end surface, and a main-surface-covering portion that covers part of the main surface continuously from the end-surface-covering portion, an electrically conductive thin film including a base-covering portion that covers the main-surface-covering portion, and a ceramic-body-covering portion that extends from the base-covering portion in the second direction and covers part of the main surface, and a plating film that covers the electrically conductive thin film and the base film.

Multi-layer ceramic electronic component having external electrode with base film and electrically conductive thin film

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode drawn to the first end surface, and a second internal electrode facing the first internal electrode and being drawn to the second end surface, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions, a dimension of the ceramic body in the first axial direction being 80 &#x3bc;m or less; a first external electrode covering the first end surface and extending from the first end surface to the first and second main surfaces; and a second external electrode covering the second end surface and extending from the second end surface to the first and second main surfaces.

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode, and a second internal electrode, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions; a first external electrode including a first cover portion and a first extension portion; and a second external electrode including a second cover portion and a second extension portion, the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axial direction, and when Trepresents a dimension of each of the first and second extension portions in the first axial direction, Tis 80 &#x3bc;m or less and T/(T+T) is 0.32 or less.

An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a longitudinal direction, and a second main surface that is concavely curved along the longitudinal direction, a distance between the first main surface and the second main surface being 50 &#x3bc;m or less; a housing portion that includes a plurality of recesses, each of the recesses including a take-out opening and housing the electronic component with the first main surface facing toward the take-out opening; and a sealing portion that covers the take-out openings of the plurality of recesses.

Electronic component package and method of housing an electronic component

A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition 't&#x3c;t,' where trepresents the thickness of each protective dielectric layer provided on respective top and bottom sides of a dielectric chip, and trepresents the thickness of a wraparound part of each external electrode provided at least part of both top and bottom faces of the dielectric chip.

Low-height multilayer ceramic capacitor

A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as 'd,' and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as 't,' then d&#x3e;t/tan 35&#xb0; and preferably d&#x3e;t/tan 25&#xb0; is fulfilled.

Mounting structure of chip component

In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.

Laminated capacitor

A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Solder circuit

A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Method of forming solder film

Solution for selectively imparting tackiness to a metallic surface

A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Growing community of inventors

Tokyo, Japan

Masataka Watabe