Canon Kabushiki Kaisha

Masataka Sakurai

Ryo Kasai

Ken Tsuchii

Nobuyuki Hirayama

Akiko Saito

Yoshiyuki Nakagawa

Kengo Umeda

Hidenori Yamato

Tomoyuki Inoue

Tatsuo Furukawa

Tatsuhito Goden

Shinji Kishikawa

Tatsurou Mori

Masahiko Kubota

Shingo Okushima

Nobuyuki Suzuki

Satoshi Oikawa

Satoshi Kimura

Keiji Tomizawa

Makoto Takagi

Ryoji Kanri

Akiko Hammura

Akihiko Okano

Sadayoshi Sakuma

Masanobu Ohmura

Tomoko Kudo

Hidenori Watanabe

Akira Shibasaki

Atsushi Hiramoto

Toru Eto

Tomoko Kurokawa

Takaaki Yamaguchi

Hideo Kanno

Masaki Oikawa

Mineo Kaneko

Koichi Ishida

Shintaro Kasai

Atsunori Terasaki

Yoshiyuki Fukumoto

Masao Furukawa

Yusuke Imahashi

Yoshihiro Hamada

Takayuki Sekine

Seiichi Kamiya

Yohei Osuki

According to one embodiment, a size of an element substrate is reduced, and a printhead using the element substrate can print high-quality image. The multilayer structured element substrate comprises a plurality of print elements, and a circuit configured to input a data signal and a clock signal used for driving the plurality of print elements. And, a print element array formed by arranging the plurality of print elements in line is diagonally arranged with respect to a side constituting an outer shape of the element substrate. A print element at one end of the print element array is a dummy element not contributing to printing. The circuit is provided not only at the same position as that of the dummy element but also in a layer different from that of the dummy element.

Multilayer structured element substrate, printhead, and printing apparatus

An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Element substrate and liquid ejection head

A recording element substrate includes a substrate, a plurality of energy generating elements arranged on the substrate to form an element row, a plurality of supply ports arranged along the element row to form a supply port row, and a plurality of supply paths extending from the plurality of supply ports along the thickness direction of the substrate, wherein a plurality of beam portions disposed between adjacent supply ports in the direction of the supply port row has a plurality of conductor layers in which a conductor layer including a power supply conductor connected to the energy generating elements and a conductor layer including a ground conductor connected to the energy generating elements, are stacked along the thickness direction of the substrate, and wherein at least one of the plurality of conductor layers is occupied by one power supply conductor or one ground conductor.

Recording element substrate, liquid ejection head, and liquid ejection apparatus

A liquid ejection head is capable of performing high-speed ejection operation as well as reducing a depth dimension. For this purpose, in a configuration in which flexible circuits electrically connect element substrates to electrical substrates, the electrical substrates are arrayed in two lines along a plane different from a plane on which the element substrates are arrayed and the flexible circuits electrically connect the element substrates to the electrical substrates while being bent.

Liquid ejection head and inkjet printing apparatus

In a print element substrate: if an amount of a voltage drop when the number of print elements driven simultaneously in a state in which the predetermined voltage is applied with respect to one print element array is largest is set as an amount of a voltage drop of the print element array, and a sum of amounts of voltage drops of the print element arrays assigned to one group is set as an amount of a voltage drop of the group, a difference between a largest value and a smallest value of the amounts of the voltage drops of the M groups is smaller than a largest value of the amounts of the voltage drops of the N print element arrays.

Print element substrate, printhead, and printing apparatus

A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side; and a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.

Print head substrate and method of manufacturing the same, and semiconductor substrate

A printhead comprises a printing element, a driving circuit configured to drive the printing element, an analog signal processing circuit configured to process one or more analog signals, a bias circuit configured to supply a bias voltage to the analog signal processing circuit, and a control terminal to which a control signal is inputted. In a state in which the analog signal processing circuit and the bias circuit are receiving a supply of power, it is possible to switch starting and stopping of at least one of the analog signal processing circuit and the bias circuit based on the control signal.

Printhead and printing apparatus

There is provided an elongated liquid ejection head capable of voltage drop suppression and high-speed ejection operation. For this purpose, in each of flexible circuits electrically connecting element substrates to electrical substrates, a width Wa on a side connected to the electrical substrate is smaller than the width of another area.

Liquid ejecting head and inkjet printing apparatus

A liquid ejection head includes a substrate including an electrically insulating film, an energy generating element provided on the substrate and configured to generate energy used to eject a liquid, a flow path formed through the substrate and communicating with an ejection port configured to eject a liquid, and a wiring layer formed in the electrically insulating film of the substrate, used to drive the energy generating element, provided apart from a wall defining the flow path, and provided to surround the flow path in a plan view of the substrate.

Liquid ejection head and liquid ejection apparatus

A liquid ejection head includes a substrate, a heat generating resistor element arranged on the substrate and a flow channel forming member for forming a flow channel. The flow channel forming member has a side wall surrounding at least part of the heat generating resistor element. The heat generating resistor element has a pair of oppositely disposed sides and a pair of electrical connection regions which extend along the respective ones of the pair of sides and are separated from the respective ones of the pair of sides by a distance. The side wall has at least one concave corner which is comprised of a curved surface or a surface extending obliquely to the pair of sides and the heat generating resistor element has at least one convex corner which faces the at least one concave corner of the side wall and is rounded or chamfered.

Liquid ejection head

A liquid discharge head which discharges a liquid, includes, a substrate on which plural heaters configured to generate heat for discharging a liquid are provided, an electroconductive protective film configured to cover the plural heaters and define a group consisting of the covered plural heaters in the substrate, a discrete wiring connected with the protective film for each group in the substrate, a common wiring connected with the discrete wiring for each group in common, and a terminal connected with the common wiring and configured to electrically connect the common wiring with an outside of the substrate, wherein electrical resistance of the discrete wiring is higher than electrical resistance of the common wiring.

Liquid discharge head and liquid discharge apparatus

Disclosed is a liquid discharge method of discharging liquid with a liquid discharge head having a heating surface that contacts and heats the liquid and a discharge port that faces the heating surface and discharges the liquid. The method includes heating the liquid through the heating surface to generate a bubble such that the bubble communicates with an atmosphere, thereby discharging the liquid. The liquid that is being discharged from the discharge port includes a trailing portion. The trailing portion moves toward the heating surface in response to a reduction in volume of the bubble and contacts the heating surface. The method further includes heating the trailing portion through the heating surface while the trailing portion is in contact with the heating surface, thereby generating a bubble.

Liquid discharge method and liquid discharge apparatus for heating a liquid through a surface to generate a bubble

A liquid ejection head having at least one energy generation element for generating heat to be used for ejecting a liquid includes an insulating layer which is provided in contact with a substrate and supports the energy generation element; at least one heat transmitting layer which is composed of a material having a higher thermal conductivity than that of a material of the insulating layer and which is provided, in the insulating layer, between the energy generation element and the substrate; and a heat transmitting member which thermally connects the at least one heat transmitting layer and the substrate, wherein the heat transmitting member is connected to an area, on the heat transmitting layer, excluding an area directly below the energy generation element in a position interposed between the energy generation element and the substrate.

Growing community of inventors

Kawasaki, Japan

Masataka Sakurai