Hitachi Chemical Dupont Microsystems, Ltd.

Other

Hitachi Chemical Company, Ltd.

Masataka Nunomura

Makoto Kaji

Hideo Hagiwara

Masayuki Ooe

Hajime Nakano

Takumi Ueno

Yoshiko Tsumaru

Noriyuki Yamazaki

Masayuki Ohe

Hiroshi Suzuki

Shigeki Katogi

Yasunori Kojima

Mitsumasa Kojima

Hidetaka Satou

Dai Kawasaki

A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (&#x2014;NH) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

There are disclosed a photosensitive resin composition which comprises  and Rrepresents a divalent organic group, and

Pattern-forming process using photosensitive resin composition

A positive-type, heat-resistant photosensitive polymer composition comprising (a) a polyimide precursor or a polyimide which is soluble in an aqueous alkaline solution, (b) a compound capable of generating an acid when exposed to light, and (c) a compound having a phenolic hydroxyl group; a method of forming a relief pattern comprising a step of applying the composition onto a substrate and drying it thereon, a step of exposing it, a step of developing it, and a step of heating it; and an electronic part having as a surface-protecting film or an interlayer insulating film.

Photosensitive polymer composition, method for forming relief patterns, and electronic parts

Disclosed are a photosensitive polymer composition comprising (a) a polymer soluble in an aqueous alkaline solution, (b) an o-quinonediazide compound, and (c) a dissolution inhibitor for the component (a) in an aqueous alkaline solution; a method of using the composition for forming relief patterns; and electronic parts having, as a passivating film or an interlayer insulating film, the relief pattern as formed in the method. The composition has high sensitivity, and give fine relief patterns having a good profile.

There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): ##STR1## represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.

Photosensitive resin composition

An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.

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Hitachi, Japan

Masataka Nunomura