Canon Kabushiki Kaisha

Masataka Nagai

Kenji Fujii

Makoto Watanabe

Yoshinori Tagawa

Toshiaki Kurosu

Hiroyuki Murayama

Takanobu Manabe

Kazuhiro Asai

Satoshi Ibe

Seiichiro Yaginuma

Mitsuru Chida

Jun Yamamuro

Koji Sasaki

Shingo Nagata

Masaki Ohsumi

Masafumi Morisue

Hiroto Komiyama

Shinji Kishikawa

Keiji Matsumoto

Masaya Uyama

Kunihito Uohashi

Ryotaro Murakami

Shuhei Oya

Keiji Edamatsu

Tomohiko Nakano

A container for liquid replenishment for replenishing liquid in a liquid ejection apparatus comprises a container body capable of containing the liquid, a spout fitted to the container body and having a front end section including a front end surface and a liquid outlet for allowing the liquid to flow out therefrom, a lid member removably attached to the spout to cover the spout and a liquid absorber arranged on the spout. The liquid outlet is open in the front end surface of the spout and the liquid absorber is arranged at least on an area of the front end surface not occupied by the liquid outlet.

Container for liquid replenishment and liquid replenishment structure

A liquid ejection head includes an ejection orifice forming member having a liquid ejection orifice and a substrate having a liquid flow path such that a liquid circulation flow path is formed between the ejection orifice forming member and the substrate. The liquid circulation flow path includes a bubble generation chamber facing the liquid ejection orifice and is branched from the liquid flow path so as to pass through the bubble generation chamber and join the liquid flow path. The substrate has an ejection energy generation element arranged to face the bubble generation chamber and a circulation energy generation element arranged at a different position to face the liquid circulation flow path. The gap between the ejection energy generation element and the ejection orifice forming member is different from the gap between the circulation energy generation element and the ejection orifice forming member.

Liquid ejection head

A liquid discharge head includes a discharge port member including a discharge port, a flow path member including a pressure chamber and a liquid flow path, a substrate, and a structure that is arranged on the substrate on an upstream side of a center of the discharge port and that is configured to generate a flow of the liquid toward the discharge port. The liquid in the pressure chamber circulates. A position corresponding to a portion of the structure having a greatest height from a surface of the substrate is located on the upstream side of the center of the discharge port in a flow direction of the liquid. A thickness of the structure in a discharge direction of the liquid is 0.1 times or greater than a thickness of the liquid flow path in the discharge direction of the liquid.

Liquid discharge head and manufacturing method of the same

In a liquid discharge head, a first pump and a second pump are arranged inside a channel, the channel includes a pressure chamber including an energy generating element, and liquid inside the pressure chamber is circulatable between inside and outside of the pressure chamber by the first pump or the second pump. The first pump is arranged on one side relative to a midpoint of the channel in an extending direction of the channel, and the second pump is arranged on another side relative to the midpoint of the channel in the extending direction of the channel.

Liquid discharge head

A method for manufacturing a perforated substrate includes forming a through-hole extending through a substrate from a first surface to a second surface opposite the first surface; forming a film on the first surface, a sidewall of the through-hole, and the second surface; forming a resist on the first surface; patterning the resist such that the resist closes an opening of the through-hole in the first surface; etching the film on the first surface using the resist as a mask; before the etching step, forming an inspection member on the second surface such that the inspection member closes an opening of the through-hole in the second surface; and determining whether there is a film patterning defect or a flaw that causes a film patterning defect.

Method for manufacturing perforated substrate, method for manufacturing liquid ejection head, and method for detecting flaw

A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.

Method for manufacturing liquid ejection head

Provided is a film formation method including the steps of: forming a resist film on an object to be applied, forming a layer of a protecting material removable by a first dissolving liquid on the upper surface of the resist film, removing the resist film from a region not having, on the upper surface thereof, the layer of the protecting material by side rinsing with a second dissolving liquid capable of dissolving the resist film therein, and removing the protecting material remaining on the upper surface of the resist film by the first dissolving liquid.

Film formation method, dry film manufacturing method and liquid ejection head manufacturing method

A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.

Method for imparting water repellency to surface of member

A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).

Process for producing a semiconductor chip

A liquid ejection head includes a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice. A sectional area perpendicular to the array direction of the ejection orifices at the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices at both ends of the beam-like projection in the array direction.

A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Method of making nozzle chip

A liquid ejection head has an element substrate constituted of a substrate body having a plurality of energy generating elements for liquid ejection and a nozzle plate having a plurality of ejection ports arranged corresponding to the respective energy generating elements so as to form a plurality of ejection port rows each extending in a first direction, the rows being arranged side by side so as to expand in a second direction intersecting the first direction. The nozzle plate has also a groove section, or a plurality of hollow sections arranged to form a hollow section row, as extending in the first direction, at least between one of the opposite edges as viewed in the second direction of the nozzle plate and the ejection port row arranged close to the same edge.

A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, each having one side and another side, the area of an inner wall of the ejection orifices is set to be larger on the other side than on the one side, the one side and the other side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice.

An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Ink jet recording head and method for manufacturing the same

Provided is a method of manufacturing a liquid ejection head, including: forming, on a substrate, a flow path mold pattern that becomes a mold of a liquid flow path; forming a negative photosensitive resin layer on the flow path mold pattern; subjecting the negative photosensitive resin layer to exposure processing with use of a reduction projection exposing apparatus and a mask pattern having an ejection orifice mask shape for forming ejection orifices; and subjecting the negative photosensitive resin layer obtained after the exposure processing to development processing to form the ejection orifices, in which the ejection orifices are formed by correcting, by the ejection orifice mask shape, an inclination of an ejection angle due to an off-axis telecentricity caused by the reduction projection exposing apparatus so as to be close to a direction perpendicular to a surface of the substrate.

Growing community of inventors

Yokohama, Japan

Masataka Nagai