Murata Manufacturing Co., Ltd.

Masataka Mae

Masaaki Okane

Takao Hosokawa

Shigeki Saito

A component drier for drying electronic components which are washed with solvent. The component drier includes a drying chamber, in which a vat having a bottom surface wall allowing passage of air and water is arranged. The vat stores components to be dried. Heated air is introduced into the drying chamber through an air inlet which is positioned above the vat. The air in the drying chamber is forcibly discharged through an air outlet which is positioned below the vat. Thus, a space under the vat has a sufficient negative pressure as compared with a space above the vat so that the air forcibly passes through clearances between the components downwardly from above the vat, thereby removing most part of the solvent moistening the components in the liquid state. A small quantity of liquid which is left on the components is subsequently efficiently vaporized by the heated air.

Component drier

Component Drier

In order to uniformly dry a large number of electronic components such as multilayer capacitors with high thermal efficiency in a short time, a vat, whose bottom wall is formed by a net, receives a plurality of electronic components. In a closed housing, hot air which is heated by a heater is forced to pass through the plurality of electronic components and the bottom wall of the vat by attraction by an air attracter.

A method of drying plurality of electronic components, which have been washed with water. The components are introduced into a drum-type container, and the container is decompressed and rotated about a horizontally directed central axis so as to stir the plurality of electronic components. The container may be at least partially dipped in a heated liquid bath, so that the container is heated by the liquid.

Method of drying electronic components

A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board. An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.

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Kyoto, Japan

Masataka Mae