Mitsubishi Gas Chemical Company, Inc.

Masataka Kudo

Syouichi Itoh

Shoichi Ito

Michio Yaginuma

Yoshitaka Ueno

Naoki Oka

Syouichi Ito

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).

Resin composition, prepreg and metal foil-clad laminate

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Tokyo, Japan

Masataka Kudo