Seiko Epson Corporation

Masataka Kazuno

Tetsuya Otsuki

Hitoshi Ueno

Mihiro Nonoyama

Takashi Aoyama

Kiminori Nakajima

Katsuhito Nakajima

Kenji Yamamoto

Ryosuke Takahashi

A method of manufacturing an electronic device in which an electronic component coupled to a lead is covered with a mold cover, includes: a coupling step of coupling the electronic component to the lead, a bending step of bending the lead to adjust a posture of the electronic component, and a molding step of molding the electronic component with a resin material to form the mold cover, and the bending step includes a lead bending step of bending the lead by pressing a pressing member against the lead without pressing the pressing member against the electronic component.

Method of manufacturing electronic device

A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

Method of manufacturing electronic devices with a cap and molding

An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

Electronic device

An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.

Sensor unit, method of manufacturing sensor unit, inertial measurement device, electronic apparatus, and vehicle

A serial communication circuit includes a receiving unit configured to serially receive input data including a command and a synchronization identification code that is different from the command and a determining unit configured to receive the synchronization identification code from the receiving unit and when the synchronization identification code coincides with a slave selection value, to instruct a start of response processing based on the command.

Serial communication circuit, integrated circuit device, physical quantity measuring device, electronic apparatus, moving object, and serial communication method

A non-volatile memory device is provided, which includes a first block for storing a first data group including a test data, a second block for storing a second data group including a complementary data to the first data group, a differential sense amplifier for generating an output value based on a difference between two input signals, a diagnostic circuit for performing a failure diagnosis using a value from the differential sense amplifier, and a control circuit which performs control such that a signal based on the test data and the complementary data is set to the input signal of the differential sense amplifier and the diagnostic circuit executes a failure diagnosis of the differential sense amplifier. The non-volatile memory device performs a failure diagnosis with high reliability capable of distinguishing between a failure of sense amplifier and a failure of a memory cell.

Non-volatile memory device and electronic apparatus

A signal judgement circuit making a judgement on a signal includes: an error signal generation circuit receiving signals via at least four signal lines and outputting an error signal when, of all the received signals, the number of signals taking on a same value does not exceed half of the number of the received signals; and an output selection circuit selecting any one of the received signals and outputting the selected signal.

Signal judgement circuit, integrated circuit device and electronic equipment

A semiconductor device includes a first semiconductor chip, and a second semiconductor chip which includes a high-speed serial I/F circuit which transfers serial data between the high-speed serial I/F circuit and an external device through a serial bus and is stacked on the first semiconductor chip. A pad region in which pads (electrodes) for connecting the external device and the high-speed serial I/F circuit are disposed is provided along a first side of the second semiconductor chip which is the short side. A pad region in which pads for connecting an internal circuit included in the first semiconductor chip and the high-speed serial I/F circuit are disposed is provided along a second side of the second semiconductor chip which is the long side.

Semiconductor device and electronic instrument

A semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The second semiconductor chip includes a high-speed serial I/F circuit which transfers serial data between the high-speed serial I/F circuit and an external device through a serial bus, and transfers parallel data between the high-speed serial I/F circuit and an internal circuit included in the first semiconductor chip. A physical layer circuit of the high-speed serial I/F circuit is disposed on a first side of the second semiconductor chip which is the short side, and a logic circuit is disposed on a third side opposite to the first side.

Growing community of inventors

Kofu, Japan

Masataka Kazuno