Nec Corporation

Masataka Itoh

Junichi Sasaki

Hiroshi Honmou

Yoshinobu Kaneyama

Isao Yoneda

Yuzo Shimada

Sakae Kitajo

Tomoaki Kato

Mikio Oda

Naoki Kitamura

Toshitaka Torikai

Kiyoshi Fukushima

Masahiko Fujiwara

Jun-ichi Sasaki

The present invention provides a photo-electric combined substrate comprising an electric interconnection part having an electric interconnection layer and an electric insulating layer as well as an optical waveguide part consisting of a core and a clad, where the electric insulating layer in the electric interconnection part and the optical waveguide part are made of the same material; a ceramic substrate comprising an optical device and an electric device where a ceramic substrate has a concave where the concave is filled with a resin, and where at least an optical device is mounted on the ceramic substrate while an electric device on the resin in the substrate concave; and an optical waveguide comprising a core and a clad having a refractive index lower than that of the core, where the core is made of a fluorene-unit-containing epoxy acrylate resin.

Photo-electric combined substrate, optical waveguide and manufacturing process therefor

The integrity of a solder jointing pad, which is used to mount an optical module, is enhanced by avoiding exposure to high temperatures used in the formation of an accompanying optical wave guide. The enhanced integrity of the solder jointing pad permits a mounting solder bump to be evenly distributed on the pad, which improves mounting position characteristics. The solder jointing pads are elongated in shape and arranged in parallel and perpendicular orientation with respect to an optical transmission path in the optical module. The enhanced integrity of the solder jointing pads permits a precise amount of solder to be introduced to the pads when mounting the optical module. The optical module can then be precisely positioned simply by varying the amount of solder introduced to the solder jointing pads. The optical device can be positioned with high accuracy by taking advantage of the self-alignment action which occurs between the molten solder bumps and the solder jointing pads. The optical module can thus be precisely positioned during manufacturing, without the need for additional adjustments.

Optical module for optical transmission and manufacturing process therefor

A semiconductor optical amplifier is mounted on a substrate which is provided for a package. Fiber blocks in which plural parallel internal optical fibers are supported are fitted to the package. The optical fibers are optically coupled with the semiconductor optical amplifier via optical waveguides formed on the substrate. V grooves for supporting the optical fibers which protrude out from the fiber block are formed on the substrate. Positionings of the optical fibers are performed by fitting the fiber blocks to the package so that end faces of the optical fibers butt against end walls of the V grooves.

Optical module and a method for fabricating a same

An optical device mounting board with electrodes mounted on the surface of the mounting board and separated from one another by grooves dividing the surface of the mounting board includes printed circuit boards having distribution lines for connecting the divided electrodes and spanning the grooves.

Optical device mounting board

A light receiving element is comprised of a light sensitive surface on a semiconductor substrate and a positive electrode (anode), a negative electrode (cathode), a mounting precision test mask, a conductive electrode wire, and solder resist on the same substrate surface. A metal thin film, a mounting alignment mark, and a mounting precision mark window are provided on the back side of the substrate. Two or more electrode surfaces having either the anode or the cathode used as the common electrode are provided. The light sensitive surface is positioned approximately in the center between these two electrode surfaces. A highly precise mounting can therefore be achieved with the solder bump, even when mounting single light receiving elements. High precision mounting is also obtained when mounting light receiving element arrays. This type of light receiving element can be precisely positioned and bonded by solder bumps to a substrate having an optical fiber fitted in the V groove.

Light receiving device for use in optical fiber communications and the

The optical fibers are arranged in a V groove formed at the surface of a silicon substrate and a cover is provided thereon. An electrode for solder bump is respectively formed at the position opposed with each other to the substrate and cover. These substrate and cover are deposited with solder in order to fix the optical fibers. The substrate or cover is previously provided, at the end point part of the optical fibers, with the mark for the positioning in the longitudinal direction of the optical fibers. The optical fibers are positioned with this mark. Here, the side surface of the optical fibers is provided with the metallized area at the position located in the predetermined distance from the end point thereof. Before fixing with the cover, the optical fibers can be deposited automatically to the predetermined position without alignment due to the self-alignment effect between the mark and metallized area. Meanwhile, the optical element can be deposited with the solder bump without adjustment to the area near the end point of the optical fiber by utilizing the self-alignment. Here, it is also possible to form the mark to the substrate for measuring the mounting position of the optical element after deposition thereof.

Coupling structure of optical fiber and optical semiconductor element

An optical module has an optical wave-guide structure formed on a silicon substrate and a laser diode array solder bonded to first pads patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.

Optical module having self-aligned optical element and optical

In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

Bump forming apparatus

Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.

Method of forming bonding bumps by punching a metal ribbon

An improved optical head comprises such a means as a prism for separating a plurality of light beams deflected from the light path between a plurality of light sources and record medium to pass at least one of the plurality of light beams through one of reflecting planes of the means and to reflect the remaining light beams of the plurality of light beams thereon for the reason why each light axis of the plurality of light beams has a slight slant to others, and the reflecting plane is shaped to have an angle such that the incidence angle of the at least oen of the plurality of light beams is smaller than the critical angle of the means, while the remaining light beams of the plurality of light beams are larger in the incidence angles than the critical angle of the means. The at least one of the plurality of light beams is detected to crrect focusing and tracking errors.

Optical head for recording informations into a record medium and

In a magneto-optical reproducing head including first and second beam splitters (21, 22) and a Faraday effect member (25) between the splitters to suppress return to a laser beam source (11) of a reversed laser beam reversedly sent from a magneto-optical recording medium (12) on which a forward laser beam is incident, the second beam splitter is made to have a transmissivity of at least 0.5 for a p-polarized component. For an s-polarized component, the second beam splitter has a reflectivity which is substantially equal to unity as usual. In order to produce a servo control signal, a signal producing circuit (17) is made to receive an s-polarized component which is substantially totally reflected in the first beam splitter and into which the Faraday effect member converts the p-polarized component having reversedly passed through the second beam splitter. The transmissivity of the second beam splitter should preferably be at least 0.75 and not greater than 0.8. An optically active member (35) is preferably interposed between the Faraday effect member and either the first or the second beam splitter. The head is readily used in recording information on the recording medium and/or in erasing such information.

Growing community of inventors

Tokyo, Japan

Masataka Itoh