Ibiden Company Limited

The Ritsumeikan Trust

Ibiden USA R&d Inc.

Masataka Ito

Dongdong Wang

Zhenhua Shao

Christopher Lee Keller

Xu Huang

Toshi K Uchida

Yoshitsugu Wakazono

Yasuhiko Mano

Tadahiko Maeda

An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate.

Antenna device

An optical interconnect device including a first printed wiring board, a second printed wiring board facing the first printed wiring board, a light-emitting device positioned on the first printed wiring board and electrically connected to the first printed wiring board, a light-receiving device positioned on the second printed wiring board and electrically connected to the second printed wiring board such that the light-receiving device faces the light-emitting device and receives an optical signal transmitted in a direct line from the light-emitting device, and an electrical-connection device mounted on the first printed wiring board and the second printed wiring board such that the first printed wiring board is electrically connected to the second printed wiring board.

Optical interconnect

An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signal to an optical signal, and a light emitting device for emitting a light. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device. The optical waveguide optically connects the light emitting and light receiving devices. The electrical wiring electrically connects the electrical wiring circuits of the first and second substrates. The switching device determines a fast signal of data to be transmitted via the optical substrate and a slow signal of data to be transmitted via the electrical wiring.

Optical interconnect device and method for manufacturing the same

A sensor control circuit for controlling a sensor unit for measuring a physical value includes a timing controller which selects periodically one or more sensor units among multiple sensor units and converts an output signal from the sensor unit to a continuous serial input signal, an oscillator which receives the serial input signal input by the controller and outputs a frequency signal corresponding to the output signal detected by the sensor unit, a counter which counts for a predetermined duration a number of pulses of the frequency signal output from the oscillator, a data converter which converts the number of pulses to voltage data and outputs the data, and an RLC selector which inputs to the converter information indicating a characteristic value on which the number of pulses is based. The characteristic value is resistance, inductance or electrostatic capacitance. The sensor units measure physical values, respectively.

Sensor control circuit and sensor

An opto-electrical hybrid wiring board is formed with a flexible wiring board; a first rigid wiring board and second rigid wiring board connected to each other by the flexible wiring board; a light-emitting element and a light-receiving element, one of which is arranged on the first rigid wiring board and the other on the second rigid wiring board; and a flexible optical waveguide for optically connecting the light-emitting element and the light-receiving element. One end of the flexible wiring board is inserted in and supported by the first rigid wiring board, and the other end is inserted in and supported by the second rigid wiring board; the rigid wiring boards and flexible wiring board are electrically connected to each other by using vias to connect the wiring of the first and second rigid wiring boards and the wiring of the flexible wiring board at the inserted portions.

Opto-electrical hybrid wiring board and method for manufacturing the same

An optical-electrical transmitting device for transmitting a signal includes an electrical signal transmitting circuit which divides a transmission signal into a first transmission signal and a second transmission signal, a switching device which is electrically connected to receive and converts the first signal into an identification signal for determining the transmission signal to be one of a fast signal and a slow signal, and a selector which is electrically connected to receive the second transmission signal and the identification signal and outputs the second transmission signal to an optical waveguide when the transmission signal is determined to be the fast signal and an electrical wiring when the transmission signal is determined to be the slow signal, the optical waveguide optically connecting the electrical signal transmitting circuit to an electrical signal receiving circuit, the electrical wiring electrically connecting the electrical signal transmitting circuit to the electrical signal receiving circuit.

Optical-electrical transmitting device

A method and structures for protectively enclosing and sealing optoelectronic modules having emitter or detector diode arrays aligned with optical fiber facets in optoelectronic transmitters and receivers. A non-hermetic enclosure provides mechanical protection of the components during alignment and assembly of the module. A substantially hermetic enclosure provides additional protection of optoelectronic components against airborne contaminants or moisture. The protective enclosures physically encompass the diode array chip with its delicate wire bonds and also provide a liquid containment dam for easier application of resin for protective encapsulation of the diode array chip. Dual resin encapsulation may include a first resin layer chosen for transparency and a harder setting covering layer. These protective variants can be implemented in different combinations offering varying degrees of protection of the optical components.

Protective sealing of optoelectronic modules

A circuit board has embedded optical fibers terminating in fiber ends which face into holes defined in the circuit board and optoelectronic emitter or detector modules mounted in the holes in optical coupling with the fiber ends. Each module is electrically connected to circuit traces on the circuit board and is optically coupled to one or more optical fibers terminating on a side surface of the hole. The modules have an optical axis oriented into the hole and a reflector supported in the hole for optically coupling the photo emitter/detector module with the fiber ends on the side surface of the hole.

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Torrance, CA, United States of America

Masataka Ito