Nec Corporation

Eightech Tectron Co., Ltd.

Masashi Tsunabuchi

Shinji Watanabe

Taihei Takeshita

Akifumi Takashima

Tadanori Ishikura

A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.

Size reduction of chip mounting system

An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.

Growing community of inventors

Niigata, Japan

Masashi Tsunabuchi