Denso Corporation

Harima Chemicals, Incorporated

Ulvac, Inc.

Masashi Totokawa

Hirokazu Imai

Yasunori Ninomiya

Eiichi Kobayashi

Akira Shintai

Yuji Ootani

Kunihiro Kodama

Katsuhiko Kanamori

Hiroshi Tanaka

Satoshi Takeuchi

Kenichi Yanai

Yorishige Matsuba

Yoshihisa Misawa

Masaaki Oda

Yukinori Migitaka

Toshihiro Suzuki

Noriyuki Abe

Tomoyasu Watanabe

Naoto Shioi

Katsuhisa Osako

Hideyuki Gotoh

Norimichi Saito

Yuuichi Sekine

Nobuto Terada

Masao Naito

Akihiro Takeichi

Atsushi Taya

In a manufacturing method of a soft magnetic member, a material powder that includes ferrous particles and an organic layer formed on a surface of each of the ferrous particles is prepared. The organic layer contains at least one element selected from the group consisting of Si, Mg, Ti, and V. The material powder is compacted to form a green compact, and the green compact is induction-heated with a frequency of 100 kHz or higher to form an insulation layer made of an oxide containing the element on the surface of each of the ferrous particles.

Soft magnetic member and manufacturing method of soft magnetic member

In S, after preforming a pressed powder member by compressing metal powder filled in a press-forming portion, the pressed powder member and metal member are slid to each other in S. In S, after temporarily joining the pressed powder member and the metal member by further pressurizing the powder member, the temporary joined pressed powder member and the metal member are sintered in a sintering furnace, and the pressed powder member and the metal member are joined by sintering diffusion in S. Thereby, joining areas between the pressed powder member and the metal member are increased, and it is possible to improve a joining strength between the pressed powder member and the metal member.

Method of manufacturing sintering diffusion joining member and manufacturing apparatus of the same

In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate.

Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer

A manufacturing method of a semiconductor device includes: irradiating a laser beam on a single crystal silicon substrate, and scanning the laser beam on the substrate so that a portion of the substrate is poly crystallized, wherein at least a part of a poly crystallized portion of the substrate is exposed on a surface of the substrate; and etching the poly crystallized portion of the substrate with an etchant. In this case, a process time is improved.

Manufacturing method of semiconductor device including etching step

A physical quantity sensor device () having a structure in which a stress-sensitive body () of which the electric characteristics vary depending upon the application of stress and an insulator () having electric insulation are formed being closely adhered together, wherein the stress-sensitive body () comprises a thin glass film containing an electrically conductive element that is solidly dissolved therein as atoms, a method of manufacturing the physical quantity sensor device, a piezo-resistive film comprising a thin glass film containing ruthenium that is solidly dissolved therein as atoms, and a method of manufacturing the piezo-resistive film.

Physical quantity sensor device and method of manufacturing the same

A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes () of a mounting substrate () and one or more surface mounting components () are connected through a conductor composition (), and one or more surface wirings () of the mounting substrate (), one or more inner-layer wirings () and one or more via conductors () are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 &#x3bc;m or less.

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.

Conductive adhesive

A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.

Method of producing circuit board

A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Conductive adhesive, method of producing the same, and bonding method

A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes () of a mounting substrate () and one or more surface mounting components () are connected through a conductor composition (), and one or more surface wirings () of the mounting substrate (), one or more inner-layer wirings () and one or more via conductors () are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (), a dispersant () for preventing aggregation of the particles (), and a scavenger () for trapping the dispersant () at the sintering are mixed in a solvent () to prepare a paste body (), and this paste body () is coated on a base material and fired, thereby forming a sensing film.

Production method of gas sensor

A pressure-sensitive sensor includes two base films opposite to each other, a pair of electrodes provided on the two base films, and first and second pressure-sensitive resistors provided by two layers on the electrodes to form a predetermined gap therebetween. Further, a contact state between the first and second pressure-sensitive resistors is changed in accordance with a pressure applied to at least one of the base films, and a resistance between the electrodes is changed in accordance with the contact state between the pressure-sensitive resistors. In addition, each of the pressure-sensitive resistors is constructed with a binder resin having an elasticity modulus in a range between 10 and 1000 Mpa, and electrical conductive particles each of which is coated with a polymer. Accordingly, the pressure-sensitive sensor including the pressure-sensitive resistors can accurately detect a pressure in a range between 1 and 20 kPa.

Pressure-sensitive resistor and pressure-sensitive sensor using the same

A multi-layer circuit board is manufactured by laminating and bonding together a plurality of resin films, on each of which a circuit pattern is directly drawn by injecting ink. The ink includes metal particles, having a diameter in the order of nanometers, dispersed therein. At the same time when the laminated resin films are bonded together under pressure and heat, the metal particles in the ink are sintered, thereby forming a solid electrical circuit printed on the resin film. Since the circuit pattern is directly drawn on the resin film, the process of manufacturing the multi-layer circuit board is simplified.

Growing community of inventors

Nagoya, Japan

Masashi Totokawa