Fujitsu Corporation

Fujitsu Automation Limited

Kyushu Fujitsu Electronics Limited

Fujitsu Microelectronics Limited

Kyushu Fujitsu Elecronics Limited

Masashi Takenaka

Masataka Mizukoshi

Taturou Yamashita

Junichi Kasai

Toshio Hamano

Masaharu Minamizawa

Masao Sakuma

Kazuto Tsuji

Makoto Iijima

Tetsushi Wakabayashi

Yoshiyuki Yoneda

Norio Taniguchi

Yukio Saigo

Takashi Mashiko

Michio Sono

Masanori Yoshimoto

Hiroshi Takahashi

Toshiyuki Honda

Kouji Saito

Hideo Sato

Shiro Yoda

Junichiro Hiyoshi

Shigeyuki Maruyama

Masanori Onodera

Hirohisa Matsuki

Tsuyoshi Aoki

Hiroshi Aoki

Toshimi Kawahara

Yasuhiro Shinma

Norio Fukasawa

Susumu Moriya

Muneharu Morioka

Ichiro Yamaguchi

Shigeo Iriguchi

Izumi Kobayashi

Koki Otake

Mitsunada Osawa

Toshiyuki Motooka

Shigeki Harada

Tatsuharu Matsuda

Joji Fujimori

Sumikazu Hosoyamada

Mitsuo Abe

Masaru Nukiwa

Yoshimi Suzuki

Kunio Kodama

Koji Sawahata

Katsuro Hiraiwa

Takao Akai

Yoshitsugu Kato

Syuichirou Takahasi

Tatsuro Yamashita

Hiroyuki Mitsue

In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case bodyso as to surround case body. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Imaging apparatus

A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Semiconductor device having a heat spreader exposed from a seal resin

A method includes a resin sealing step of placing, in a cavityof a mold, a substrateto which semiconductor elementson which bumpsare arranged, a resin sealing step of supplying resinto positions of the bumpsso that a resin layersealing the bumpsis formed, a protruding electrode exposing step of exposing at least ends of the bumpssealed by the resin layerso that ends of the bumpsare exposed from the resin layer, and a separating step of cutting the substratetogether with the resin layerso that the semiconductor elementsare separated from each other.

Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Semiconductor device and method of forming the same

A tape carrier package formed by a TAB technique is provided. This tape carrier package includes a semiconductor chip and a TAB tape. The TAB tape has a rectangular device hole in which the semiconductor chip is situated, and inner leads extending inward in the device hole and bonded to the electrode bumps of the semiconductor chip. The inner leads (corner leads) at each corner of the device holes are reinforced by reinforcing leads.

Tape carrier package

A semiconductor device having a semiconductor chip on a TAB (Tape Automated Bonding) tape with high reliability is provided. The semiconductor device of the present invention includes a TAB tape which has a base film provided with a device hole in a position where a semiconductor chip is mounted, a wiring pattern whose end portions constitute inner leads connected to the semiconductor chip and terminal connecting portions provided with solder balls, and a photo-solder resist which protects the wiring pattern. Chamfered portions which relieves internal residual stress caused in the photo-solder resist due to the difference in thermal expansion coefficient between the base film and the photo-solder resist are formed at locations on the photo-solder resist facing the corners of the device hole.

Semiconductor device

A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Method of forming an assembly board with insulator filled through holes

Semiconductor device and assembly board having through-holes filled with

A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

Semiconductor device and method of forming the device

A semiconductor device includes a device body including at least an LSI chip, and a lead structure having a base which is flexible and a plurality of pins which project from both sides of the base. The lead structure is integrated with the device body so that first ends of the plurality of pins are electrically connected to the LSI chip. The semiconductor device is manufactured in accordance with two steps of forming the lead structure and of integrating the lead structure with the deice body so that the first ends of the plurality of pins are electrically connected to the LSI chip.

Semiconductor device and method for manufacturing such

A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

Test board for testing a semiconductor device, method of testing the

A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Semiconductor device, carrier for carrying semiconductor device, and

A process for manufacturing semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Process for manufacturing a semiconductor device having a stepped

A semiconductor device includes a board base having through-holes filled with a filling core, and an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths. The semiconductor device further includes a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a passage restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.

Growing community of inventors

Kawasaki, Japan

Masashi Takenaka