Sharp Kabushiki Kaisha Corporation

Fuji Machinery Mfg. & Electronics Co., Ltd.

Masashi Takemoto

Nobuaki Aoki

Nobuyuki Takahashi

Kiyohisa Ohta

Kenichi Ukai

Yasuji Takenaka

Yoshiteru Ogawa

Yasuji Tanenaka

Syuji Takahashi

Tomio Wakamatsu

There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrateand interconnect patternsA,B formed on the surface thereof are covered with an acrylic resin primerhaving better gas barrier property than a silicone resin sealing resin part. Light resistance is ensured by the silicone resin sealing resin portionand the gas barrier property can be ensured by the acrylic resin primer

Light emitting device and method for producing same

A backlight device () includes: an LED package () including an LED chip (A) and an Ag reflective layer (B); and an optical member (for example, a prism sheet ()) for adjusting light emitted from the LED package (). The optical member () adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (B).

Backlight device, liquid crystal display device and illuminating device

A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.

Method for manufacturing light reflecting metal wall

Growing community of inventors

Osaka, Japan

Masashi Takemoto