Mitsubishi Denki Kabushiki Kaisha

Ryoden Semiconductor System Engineering Corporation

Spc Electronics Corporation

Masashi Omori

Hiroaki Ishikawa

Hiroshi Tanaka

Nobuaki Doi

Tetsuji Oishi

Masatoshi Hirokawa

Yusuke Abe

Haruki Sonoda

Kazuto Nishizaki

Ei-Ichi Ando

There are provided a band-shaped tray having grasping grooves for grasping opposite side ends of wafers and a cleaning tank to which the wafers inserted in the tray are conveyed by a conveyor robot to be cleaned. The cleaning tank is provided with guides for mounting the tray in the tank, a bottom portion formed substantially in V-shape conforming to the bottom-face shape of the wafer and flow ports via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank is provided with an overflow tank for containing the cleaning fluid overflowing from the cleaning tank and the overflow tank is provided with a circulation line for circulating the cleaning fluid again into the cleaning tank

Wafer cleaning device and tray for use in wafer cleaning device

A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank for holding workpieces is provided, a supply line for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve for adjusting the flow of the cleaning solution is disposed in the middle of the supply line . The valve is equipped with a switching section for controlling the outflow of the cleaning solution by opening or closing the supply line , and a bypass for supplying the cleaning solution, bypassing the switching section . The valve is provided such that it is able to adjust in two steps the supply flow of the cleaning solution supplied to the cleaning tank by using the supply flow fed through the bypass and the supply flow fed through the switching section

Multi-step flow cleaning method and multi-step flow cleaning apparatus

A material to be dried, such as a semiconductor substrate during manufacturing a semiconductor device, is loaded into a process chamber fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. A processing solution vapor is fed through a steam supply port in the second surface into the process chamber and flowed downwardly over the material to be dried. The processing solution vapor is condensed and recovered below the material to be dried.

Stream drying process

A steam drying apparatus in which a process chamber is fitted at a loading opening with a lid which is closed from above. The inner side wall surface of the process chamber has a first surface formed in the lower part thereof and is substantially in parallel with the inner wall surface of the lid, and a second surface extending from the upper end part of the first surface and bent outwards to face the inner wall surface of the lid. The second surface is provided with a steam supply port for supplying the processing solution vapor into the process chamber. To the steam supply port is connected a steam supply means for supplying the processing solution vapor into the process chamber.

Steam drying apparatus, cleaning apparatus incorporating the same, and

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Shizuoka-ken, Japan

Masashi Omori