Nec Corporation

Masashi Ohi

Toshihiko Nishiyama

Atushi Kobayashi

Shinji Takeoka

Takashi Fukaumi

Hiromichi Taniguchi

Satoshi Arai

Atsushi Kobayashi

Koji Sakata

Eishun Tsuchida

Yoshihiko Saiki

Kimihisa Yamamoto

Tomitaro Hara

Yoshitaka Fujishima

Kumihisa Yamamoto

Atsuhiko Fujita

Kazuaki Fukushima

Eishun Tuchida

An oxidant solution for synthesizing a heat-resistant electroconductive polymer, composed of a solution of a non-protonic organic solvent and an oxidant of the organic compound iron salt expressed by the following formula:

Oxzidant solution for synthesizing heat-resistant electroconductive

The solid electrolytic capacitor comprises a sealed capacitor element having, as a solid electrolyte layer, a heat resistant conductive layer formed on a dielectric oxide film. The heat resistant conducting polymer layer contains water, and the capacitor element inside is substantially oxygen-free. A cathode conductive layer is provided on the capacitor element and then both an external cathode lead and an external anode lead are mounted on the capacitor element. Water is supplied to the conducting polymer layer of the capacitor element such that the conducting polymer layer inside contains water. The capacitor element is then sealed such that water is held within the heat resistant conducting polymer layer and that the capacitor element inside is substantially oxygen-free. The step of supplying water is carried out by dipping the heat resistant conducting polymer layer in water or heavy water or exposed to water-containing inert gas. The capacitor element is sealed in a water-containing oxygen-free inert gas atmosphere. The resulting capacitor has excellent heat resistance.

Heat resistant conducting polymer, solid electrolytic capacitor using

A solid electrolytic capacitor free of short circuits which may be caused by the creeping of a solid electrolyte comprising a conducting polymer, and having high volume efficiency per volume. The solid electrolytic capacitor is constructed by successively forming an oxide film, a solid electrolyte (conducting polymer) and a cathode layer on an anode body which has an anode lead planted thereon. Then heating is applied, by a heater chip, to a part of the solid electrolyte that has crept from the head of the anode body along the anode lead to convert it is insulation, so as to produce a solid electrolyte insulated portion thereby. Or, in another way, the creeping solid electrolyte can be removed by heating with a heater chip and generating a thermal decomposition reaction thereof while supplying sufficient additional oxygen.

Method of manufacturing a solid electrolytic capacitor

A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.

Method of forming chip-formed solid electrolytic capacitor without an

Chip-formed solid electrolytic capacitor without an anode lead

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Tokyo, Japan

Masashi Ohi