Seiko Instruments Inc

Masashi Numata

Kiyoshi Aratake

Kazuyoshi Sugama

Keiji Sato

Hitoshi Takeuchi

Yasuo Kawada

Takahiko Nakamura

Sadao Oku

Yoichi Funabiki

Daisuke Terada

Osamu Onitsuka

Takeshi Sugiyama

Junya Fukuda

Sumihiko Kurita

Shuji Yamane

Kyoshi Aratake

Hiroshi Higuchi

Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assemblyalong a scribe line M', the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assemblyalong the contour line to form the scribe line M&#x2032; on a lid board wafer; and a breaking step of applying a breaking stress along the scribe line M&#x2032; using a cutting blade to cut the wafer assembly along the scribe line M&#x2032;, wherein the scribing step involves forming the scribe line M&#x2032; so that the ratio of a depth dimension D of the scribe line M&#x2032; to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Method of manufacturing piezoelectric vibrators

A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Method of manufacturing a piezoelectric vibrator

To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component () is formed by bonding together a base () made of glass and a lid (). Outer electrodes () and () are formed on a bottom surface of the base (), and the outer electrodes () and () are respectively connected to through electrodes () and (). The outer electrodes () and () each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes () and () are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Electronic component and electronic device

A method for fabricating a piezoelectric vibrator includes inserting a filling member formed with a through hole inside of a ring having a substantially cylindrical shape, and inserting one piece of a lead to the through hole of the filling member to project from both sides of the ring. The method further includes sintering the filling member along with the ring and the lead to integrate in an airtight manner, subjecting an exciting electrode of the piezoelectric vibrating piece to a bump connection with an inner lead portion of the lead projected from the ring, subjecting another exciting electrode on a side of the piezoelectric vibrating piece opposed to the other exciting electrode to wire bonding with the ring, and press-fitting the ring to an opening portion of a case and sealing the piezoelectric vibrating piece connected with the inner lead portion inside of the case in an airtight manner.

Method of fabricating a piezoelectric vibrator

A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15&#xb0; or more and 20&#xb0; or less, and a conductive paste that is hardened after being filled in the through hole.

Piezoelectric vibrator, oscillator, electronic equipment and radio-controlled timepiece, and method of manufacturing piezoelectric vibrator

Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holeson a base substrate wafera core portion insertion step of inserting core portionsof a rivet memberinto the penetration holes from one side of the wafer; a melting step of bringing the rear surface of the base portionof the rivet member into contact with the wafer to close the opening end on the one side of the penetration holes, heating the wafer while pressing the other side of the wafer so as to melt a surface portion on the other side of the wafer to produce a liquid base substrate materialand causing the material to flow into gaps between the inner circumferential walls of the penetration holes and the rivet member from the other side of the penetration holes so as to close the gaps; a curing step of cooling and curing the material poured into the gaps; and a polishing step of removing the base portion and polishing the wafer and the rivet member so that the base substrate wafer and the core portion are planarized.

Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.

Electronic device, electronic apparatus, and electronic device manufacturing method

A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode membersare disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members. In the welding step, a pressurizing mold is placed on the surface of the wafer, the wafer is pressed by the pressurizing mold, and the wafer and the electrode members are heated to a temperature higher than the softening point of the first glass material and the softening point of the second glass material, whereby the wafer and the electrode members are welded to each other.

Package manufacturing method and apparatus for piezoelectric oscillator

Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodesin the base board; a penetration electrode alignment step of inserting a core portionof a conductive rivet memberinto the penetration hole of the base board; a glass frit filling step of applying a paste-like glass fritonto the other surface of the base board and filling the glass frit into the penetration hole; and a baking step of baking and curing the glass frit, wherein the glass frit filling step involves forming a glass frit filling portionhaving a larger diameter than the penetration hole and filling the glass frit also into the glass frit filling portion.

In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Electronic device and method of manufacturing the same

An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

Method of manufacturing electronic-parts package

A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass&#x2267;frit&#x3e;core.

Piezoelectric vibrator

There is provided a piezoelectric vibratorthat includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodesand, a pair of through electrodesand, and routing electrodesand. The lid substrateincludes a recessfor a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reedis bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between both the substrates. The pair of external electrodesandis formed on the lower surface of the base substrate. The pair of through electrodesandis formed by hardening paste P, which contains a plurality of metal fine particles and a plurality of metal beads P, so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodesandare formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The melting point of the metal bead is higher than the firing temperature of the paste.

Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio clock

There is provided a piezoelectric vibratorthat includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodesand, a pair of through electrodesand, and routing electrodesand. The lid substrateincludes a recessfor a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reedis bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodesandis formed on the lower surface of the base substrate. The pair of through electrodesandis formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodesandare formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed. The through electrodes include electrode filmsandthat are formed on the inner surfaces of the through holesand, and glass bodiesandthat are fixed to the inner surfaces of the through holes with the electrode films interposed therebetween so as to close the through holes.

Method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio-clock

A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a direction perpendicular from a surface of the tabular basis part, where the core part is inserted into a through-hole formed in the base substrate and the basis part is removed by polishing the base substrate.

Growing community of inventors

Chiba, Japan

Masashi Numata