Kabushiki Kaisha Toshiba

Masashi Noda

Jun Tanaka

Takashi Imoto

Akira Tanimoto

Yoriyasu Ando

Naoki Iwamasa

Masatoshi Kawato

Masaji Iwamoto

Yusuke Dohmae

Koichi Miyashita

In one embodiment, a semiconductor device includes a first semiconductor chip disposed on a circuit board, an adhesive layer fixing the first semiconductor chip to the circuit board, and a second semiconductor chip having an outer shape smaller than that of the first semiconductor chip. At least a part of the second semiconductor chip is embedded in the adhesive layer. The adhesive layer has a thickness in a range of 95 to 150 &#x3bc;m. The adhesive layer includes a cured product of a thermosetting resin whose thermal time viscosity at a time that the second semiconductor chip is embedded is in a range of 500 to 5000 Pa&#xb7;s.

Semiconductor device and method for manufacturing the same

Growing community of inventors

Ichinomiya, Japan

Masashi Noda