Hitachi, Ltd.

Fujitsu Hitachi Plasma Display Limited

Masashi Nishiki

Ryohei Satoh

Akira Yabushita

Michifumi Kawai

Masahito Ijuin

Shigeaki Suzuki

Yuzo Taniguchi

Tomohiko Murase

Tomohiro Murase

Makoto Fukushima

Hidetaka Shigi

Eiji Matsuzaki

Haruhiko Matsuyama

Hideo Sotokawa

Tetsuya Yamazaki

Yukio Maeda

Motonari Kifune

Takehiko Hasebe

Naoya Kitamura

Masayuki Kyooi

Minoru Tanaka

Mamoru Ogihara

Akira Shimoyoshi

Hisashi Okada

Toshio Terouchi

A plasma display panel includes a substrate, a plurality of metal electrodes, and a dielectric layer. The plurality of metal electrodes are formed on the substrate in a predetermined direction. The dielectric layer is formed on the metal electrodes by firing a glass material. The metal electrodes are formed with a film thickness of 6 &#x3bc;m or less. The dielectric layer is formed with a film thickness of 25 &#x3bc;m or less.

Plasma display panel and manufacturing method thereof

An exposure process using photomasks, the process includes the steps of: providing a plurality of glass photomasks for optical lithography with respect to a target substrate to be processed, the photomasks having identical exposure patterns, and exposing the target substrate a plurality of times using the plurality of glass photomasks.

Exposure process and apparatus using glass photomasks

A gas discharge type display apparatus includes a front substrate having a plurality of first electrodes and a back substrate having a plurality of second electrodes and at least ones of the first and second electrodes are made of the photosensitive material containing silver exposed by using the laser thereby, making a mask unnecessary.

Wiring board and gas discharge type display apparatus using the same

A gas discharge display device having a first substrate, a plurality of first electrodes having a substantially rectangular form being arranged on the first substrate, a plurality of second electrodes, respective ones of the plurality of second electrodes being formed on respective ones of the plurality of first electrodes, and each of the plurality of second electrodes having an extension extending beyond an end of a respective one of the plurality of first electrodes on which respective ones of the plurality of second electrodes are formed and in an oblique direction therefrom. The extension of the plurality of second electrodes extend beyond opposite ends of alternate ones of the plurality of first electrodes.

Method of making gas discharge display panel and gas discharge display device

A gas discharge display device comprising a front side substrate having a plurality of first electrodes and a back side substrate having a plurality of second electrodes, wherein at least said first electrodes or second electrodes are formed by wet etching using a resist made of an inorganic material, is excellent in the ability to suppress the breakage of wiring in electrodes.

Wiring substrate and gas discharge display device

A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows. Subsequently, second windows of a particular shape are provided in regions of layers of the insulating resin filled in the windows, and independent conducting paths are formed through the second windows to extend from front sides of the second windows to back sides thereof. The conducting paths are formed radially to be spaced a substantially equal distance from centers of the respective second windows.

Multi-layer wiring substrate and manufacturing method thereof

A method of making a gas discharge display panel and a gas discharge display device using laser processing so that the manufacturing time to form wiring on a substrate thereof is significantly reduced. In order to achieve this, the gas discharge display panel is provided with a first substrate having a plurality of first electrodes and a plurality of second electrodes, and the first electrodes are laser processed to have a substantially rectangular shape. The second electrodes are formed on the first electrodes, and a second substrate having a plurality of third electrodes which is opposed to the first substrate is provided.

Gas discharge display panel and gas discharge display device having electrodes formed by laser processing

Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes

A method of making a gas discharge display panel including the steps of providing a first substrate having a plurality of first electrodes and a plurality of second electrodes, laser processing said first electrodes into a rectangular form, forming the second electrodes on the first electrodes and providing a second substrate having a plurality of third electrodes and being opposed to the first substrate.

Wiring substrate and gas discharge display device and method therefor

A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.

Metalization structure and manufacturing method thereof

Growing community of inventors

Yokohama, Japan

Masashi Nishiki