Mitsubishi Materials Corporation

Mitsubishi Kinzoku Kabushiki Kaisha

Mitsubishi Metal Corporation

Masashi Komabayashi

Kenichi Hijikata

Kunio Kuramochi

Tadashi Sugihara

A p-type Fe silicide thermoelectric conversion material comprises an Fe silicide, wherein at least one of Cr and V is substituted for part of Fe in the Fe silicide. The Fe silicide is chemically expressed as Fe.sub.1-x M.sub.x Si.sub.2, wherein the value of x falls within a range of 0.01 to 0.1, and M represents the at least one of Cr and V. Alternatively, at least one of Cr and V, and Mn are substituted for part of Fe in the Fe silicide. In this case, the Fe silicide is chemically expressed as Fe.sub.1-x (M+Mn).sub.x Si.sub.2, wherein the value of x falls within a range of 0.01 to 0.1, where M represents the at least one of Cr and V.

P-type Fe silicide thermoelectric conversion material

A thermoelectric element comprises a first layer of a p-type iron silicide, and a second layer of an n-type iron silicide. The first and second layers are joined together to form a pn junction therebetween. An insulating layer of an oxide is interposed between the first and second layers at portions thereof other than the pn junction. The oxide forming the insulating layer consists essentially of 38.0-50% by weight SiO.sub.2, 0.1-10.0% by weight B.sub.2 O.sub.3, and the balance of MgO and inevitable impurities. In manufacturing the thermoelectric element, one of a powder of the p-type iron silicide and a powder of the n-type iron silicide, a powder of the insulating layer-forming oxide, which may be in the form of a sheet, and the other of the powder of the p-type iron silicide and the powder of the n-type iron silicide are charged into a hot pressing mold in the mentioned order, whereby a laminated body is formed within the mold. The laminated body is hot pressed into a sintered body, which is then heated treated in the atmosphere.

Thermoelectric element and method of manufacturing same

A novel target material for use in the sputter formation of a metal silicide film in electrode wiring in a semiconductor device, and a process for producing such target material are disclosed. The process for producing the target material is characterized by first impregnating molten silicon into a calcined body containing at least one silicide forming metal component and a silicon component and then forming a sintered body with a reduced oxygen content containing both a metal silicide and silicon. The target material prepared in accordance with the invention is extremely low not only in oxygen content but also in the concentrations of other impurities and has high deflective strength as compared with the conventional sintered target. The film formed by sputtering the target of the invention has appreciably reduced impurity levels and hence, very low electric resistivities. The target of the invention enables sputtering to be performed 5 times as fast as in the case using the conventional sintered target.

Growing community of inventors

Ohmiya, Japan

Masashi Komabayashi