Samsung Electronics Co., Ltd.

Shiseido Company, Limited

Masashi Kikuchi

Michio Ishikawa

Kazuyuki Tomizawa

Makoto Kobayashi

Myoung-Soo Park

Siqing Lu

Takafumi Noguchi

Masahiro Matsuoka

Kazuhiro Yamamuro

An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.

Electrostatic chuck and wafer etching device including the same

A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.

Wafer stage and method of manufacturing the same

A wafer loading apparatus capable of making a temperature distribution in a surface of a wafer more uniform is provided. The wafer loading apparatus includes a stage on which a wafer is loaded, and a heater installed in the stage to heat a wafer loaded on a loading surface of the stage. The stage includes a top plate providing the loading surface. The heater includes first heater coils disposed on a surface of the top plate opposite to the loading surface, electrode portions electrically connected to the first heater coils and arranged side by side along an outer peripheral portion of the top plate, and a second heater coil disposed outside the first heater coils. The second heater coil generates heat in such a way that a heat distribution in a circumferential direction is varied corresponding to the arrangement of the electrode portions.

Wafer loading apparatus and film forming apparatus

A naphthalene derivative having the general formula: ##STR1## wherein R represents hydrogen, an alkyl group having 1 to 8 carbon atoms, an R.sup.1 O (CH.sub.2).sub.n group, or a benzyl group, R.sup.1 represents hydrogen or a lower alkyl group, and n represents an integer of 2 or 3. This compound in the leuco state can be stably isolated and can produce a strong and fast color upon oxidation under moderate conditions. This compound can be advantageously included in a hair dye composition, which is capable of stably and safely dyeing hair with a good and stable color under moderate conditions.

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Yokohama, Japan

Masashi Kikuchi