Tdk Corporation

Masashi Katsumata

Yoshihiro Suzuki

Kazutoshi Tsuyutani

Kenichi Kawabata

Toshiyuki Abe

Hisayuki Abe

Takashi Watanabe

Ken Ishino

Taro Miura

Takaaki Morita

Toshikazu Endo

Shinya Nakai

Atsushi Ajioka

Yasuyuki Hattori

Tomohide Yokozawa

Kazuo Kudoh

Yoshiaki Fukumitsu

Michitaka Okazaki

Takuro Aoki

Reo Hanada

Takeshi Endo

Takehiko Ishizuka

Kenta Nagai

Disclosed herein is a semiconductor IC-embedded substrate that includes insulating layers, conductor layers, and a semiconductor IC embedded in the insulating layers. The insulating layers includes first and second insulating layers. The conductor layers includes a first conductor layer having a first wiring pattern and a second conductor layer having a second wiring pattern. The semiconductor IC includes a rewiring pattern connected in common to power supply pads. The rewiring pattern is connected to the first wiring pattern via a first opening of the first insulating layer. The first wiring pattern is connected to the second wiring pattern via second openings of the second insulating layer. The first opening is greater in area than each of the second openings.

Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing method

Disclosed herein is a multilayer circuit board that includes a plurality of conductor layers laminated with insulating layers interposed therebetween. The plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers. The first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.

Multilayer circuit board

Disclosed herein is a circuit board that includes a first insulating layer having an upper surface; a first wiring layer embedded in the first insulating layer, the first wiring layer having an upper surface exposed from the upper surface of the first insulating layer such that the upper surface of the first wiring layer is substantially coplanar with the upper surface of the first insulating layer; a semiconductor IC mounted on the upper surface of the first wiring layer with a die attach material interposed therebetween; and a second insulating layer stacked on the upper surface of the first wiring layer so as to embed the semiconductor IC, wherein a bottom surface of the die attach material is in contact with both of the upper surface of the first insulating layer and the upper surface of the first wiring layer.

Circuit board incorporating semiconductor IC and manufacturing method thereof

Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.

Electronic circuit module and manufacturing method of the same

Disclosed herein is an IC embedded substrate that includes a core substrate having an opening, an IC chip provided in the opening, a lower insulating layer, and upper insulating layer. The IC chip and the core substrate is sandwiched between the lower insulating layer and the upper insulating layer. The upper insulating layer is formed in such a way as to fill a gap between a side surface of the IC chip and an inner peripheral surface of the opening of the core substrate. A first distance from the upper surface of the IC chip to an upper surface of the upper insulating layer is shorter than a second distance from the upper surface of the core substrate to the upper surface of the upper insulating layer.

IC embedded substrate and method of manufacturing the same

A multilayer substrate according to the present invention includes a plurality of laminated insulating layers and conductive patterns formed between the respective insulating layers. The conductive patterns include a first conductive pattern having a predetermined thickness and a second conductive pattern thicker than the first conductive pattern. The first and second conductive patterns are located in the same layer. The first conductive pattern is formed by pattern-etching a conductive layer having a uniform thickness by the subtractive method. The second conductive pattern is formed by forming a pattern-forming groove and then filling the inside of the pattern-forming groove with a conductive material simultaneously with forming a via hole. The first conductive pattern is suitable for an LC pattern for a high-frequency circuit requiring small variations in the width and the thickness of the pattern as well as accuracy in the thickness relative to an insulating pattern, and for a normal conductive pattern requiring impedance matching. The second conductive pattern is suitable for an L pattern for a choke coil.

Multilayer substrate and manufacturing method thereof

A semiconductor IC-embedded modulecomprises a multilayer substratehaving first and second insulating layersand, and a controller ICand memory ICthat are embedded in the multilayer substrate. A wiring layeris formed as an internal layer in the multilayer substrate. Part of the wiring layerconstitutes a bus lineX. The controller ICor memory ICis embedded in the second insulating layer. First and second ground layersandare provided respectively in the first and second insulating layersand. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.

Inductor element containing circuit board and power amplifier module

A small-sized, front-end module is offered which is for use in a wireless communication device such as a mobile phone and which can suppress harmonics to a sufficiently low level. The front-end module has at least a switching circuit for switching one antenna between a transmiting system and a receiving system, a power amplifier for power-amplifying a transmission signal, and a low-pass filter inserted between the switching circuit and power amplifier. These components are integrated. A first kind of harmonics is produced from the switching circuit toward the power amplifier and reflected by the low-pass filter. A second kind of harmonics is produced from the power amplifier toward the antenna. A third kind of harmonics is produced from the switching circuit toward the antenna. The third kind of harmonics is canceled by the reflected first kind of harmonics and the second kind of harmonics.

Front-end module and communication terminal

The present invention is to provide a surface mounting part, capable of corresponding to high density mounting of a mother board and capable of achieving a small size, to be mounted on a mother board by reflow. Electronic parts are mounted on both sides of a printed board. Terminal electrodes of the electronic parts mounted on the rear side are provided as terminals for connecting with the mother board.

Surface mounting part

A voltage-controlled oscillator and a method capable of precisely adjusting a frequency shift amount are provided irrespective of a fluctuation in characteristics of elements such as a strip-line. A center tap 19 is formed in a strip-line 16 of a resonator. A switching element 20 is connected to the center tap 19, and this switching element 20 is turned ON, so that the center tap is shortcircuited to the ground so as to vary the oscillating frequency. A slit A1 is conducted in the vicinity of the center tap 19 along the strip-line 16 and directed toward a shortcircuited end 17 of the strip-line, so that a frequency shift amount is adjusted. Also, a slit B1 is conducted in the vicinity of the shortcircuited end 17 along the strip-line 16 and directed toward the center tap 19, so that a frequency shift amount is adjusted. Also, trimming points are provided on the side of a hot terminal 18 from the center tap 19, and also provided on the side of the shortcircuited end 17 from the center tap 19, and further a slit is conducted along an intersecting direction of the strip-line 16, so that a shift amount is adjusted.

Voltage-controlled oscillator and method for adjusting frequency shift

A voltage controlled oscillator including a resonator which generates an oscillation signal, a frequency of which is in response to a control signal, and an amplifier which amplifies the oscillation signal. Also included is a frequency adjusting mechanism, as well as a voltage control sensitivity mechanism. In one example, the resonator includes an input terminal to which the control signal is applied, a variable capacitance diode and a main inductor. The oscillation frequency adjusting mechanism includes a first variable capacitor, arranged in parallel with the main inductor of the resonator. In addition, the voltage control sensitivity adjusting mechanism includes a second variable capacitor arranged between the input terminal and the amplifying mechanism, and also arranged between a hot terminal of the variable capacitance diode and a hot terminal of the main inductor.

Voltage controlled oscillator and sensitivity adjustment

A flat wave absorber having a conductive plate, a dielectric plate on the conductive plate, and, a ferrite plate on said dielectric plate, provides a wide operational frequency range from 30 MHz to 1 GHz with excellent attenuation characteristics, and an anechoic chamber mounting said wave absorber on inside surface of the chamber is provided. Thickness of said dielectric plate is less than 25 mm, the thickness of said ferrite plate is less than 7.5 mm, and real part of complex impedance of said ferrite plate on the conductive plate is less than 1.0 and close to 1.0. Said ferrite plate is attached to said dielectric plate in the form of tiles.

Growing community of inventors

Tokyo, Japan

Masashi Katsumata