Nippon Steel Chemical Co., Ltd.

Nippon Steel & Sumikin Chemical Co., Ltd.

Masashi Kaji

Koichiro Ogami

Kazuhiko Nakahara

Takanori Aramaki

Yasuharu Yamada

Norito Nakahara

Hisashi Yamada

Kiwamu Tokuhisa

Tomomi Fukunaga

Akira Mori

Hisayuki Nagino

Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, Rand Reach is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.

Aromatic ether polymer, method for producing the same, and polymer composition

Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320&#xb0; C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O&#x2014;CH&#x2014;CH(OH)&#x2014;CH&#x2014;O&#x2014;B&#x2014;, wherein A and B are divalent aromatic groups.

Crystalline resin cured product, crystalline resin composite material, and method for producing the same

Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250&#xb0; C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Flame-retardant adhesive resin composition and adhesive film using the same

This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein Ris H, alkyl or the like, X is a crosslinking group represented by &#x2014;C(RR)&#x2014; or C(RR)&#x2014;Ar&#x2014;C(RR)&#x2014; (wherein R-Rare H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Indole resins epoxy resins and resin compositions containing the same

This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3)wherein Ydenotes a glycidyloxyarylmethyl group represented by &#x2014;CH&#x2014;Ar&#x2014;OG, Yand Ydenote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.

Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles

An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices. ##STR1##

Epoxy resin composition

This invention relates to naphthol aralkyl resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15 and cured products thereof, which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.

Naphthol aralkyl resins and cured products thereof

The invention relates to naphthol-based epoxy resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15, naphthol aralkyl resins which are intermediates for said epoxy resins, a process for the preparation of said naphthol aralkyl resins, and epoxy resin compositions containing said naphthol-based epoxy resins which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.

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Kitakyushu, Japan

Masashi Kaji