Nichia Corporation

Masashi Ishida

Tadayuki Kitajima

Daisuke Sato

Saiki Yamamoto

Yoshiyuki Ide

Tatsuya Hayashi

Atsushi Hashizume

Takeshi Aki

Hiroshi Kono

A mounting substrate includes: a base; and at least one pair of wiring patterns disposed apart from each other on the base. At least one of the wiring patterns has a mounting portion, which is configured to support an electronic part thereon and which is rectangular in a plan view. The at least one of the wiring patterns defines a hole, which exposes a part of the base and which is disposed in at least a part of an outer edge of the mounting portion.

Mounting substrate and electronic device including the same

A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

Method for manufacturing light emitting device and light emitting device

Light emitting diode

A light emitting device comprises: a light emitting element; a plurality of lead frames to which the light emitting element is electrically connected; and a package that includes in its interior at least part of said lead frames which protrude outward at one end, that is equipped with an opening for taking off light from the light emitting element, and that extends in the lengthwise direction, wherein a concave portion is formed in the outer surface of at least part of the package wall, the lead frames protruding outward from the package are accommodated in this concave portion, and the walls that constitute said opening and are across from each other in the widthwise direction of the package comprise at least a first wall that is across from the light emitting element, a second wall that is raised up by a step from the first wall, and a third wall that links the first wall and the second wall, and the second wall and third wall are formed thicker than the first wall.

Light emitting device

Light emitting diode (side view type)

Growing community of inventors

Naka-gun, Japan

Masashi Ishida