Tyco Electronics Amp K.k.

Masashi Inoue

Shuji Kajinuma

Shinichi Hashimoto

Hiroshi Shirai

Masayuki Aizawa

Doron Lapidot

Shinsaku Toda

Hiroshi Kaneko

An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.

IC socket

A board mounted electrical connector includes signal contacts, grounding contacts, and an insulative housing for holding the signal contacts and the grounding contacts. At least one pair of signal contacts and a grounding contact corresponding to the pair of signal contacts are arranged in two rows at an engagement portion of the insulative hosing. Leg portions of the signal contacts and the grounding contacts, which are to be mounted onto a circuit board, are arranged in three rows at positions closest to an engagement surface of the insulative housing to positions furthest from the engagement surface. Leg portions of the grounding contacts are provided in the first row closest to the engagement surface.

Board mounted electrical connector

A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.

Land grid array socket

Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.

Growing community of inventors

Kanagawa, Japan

Masashi Inoue