Ngk Insulators, Inc.

Masashi Hayakawa

Takao Saito

A DLC film mass-producing apparatusincludes a chamberconnected to ground. In the chamber, a plurality of plate-shaped substratesare disposed in parallel at regular intervals, without disposing a counter electrode that faces each of the plate-shaped substrates. Sputtering cleaning is then conducted by plasma discharge and an underlying contact layer is formed on each of the plate-shaped substrates. Subsequently, a DLC film is produced on each of the plate-shaped substratesby injecting a carbon source gas into the chambersuch that the internal pressure of the chamberreaches 0.1 to 10 Pa and applying a negative DC pulse voltage having a pulse half width of 0.1 to 3 &#x3bc;sec to each of the plate-shaped substratesto generate plasma.

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Nagoya, Japan

Masashi Hayakawa