Kabushiki Kaisha Nihon Micronics

Fujikura Limited

Nec Corporation

Daiichi Sankyo Company, Limited

Daiichi Pharmaceutical Co., Ltd.

Ricoh Company, Ltd.

Masashi Hasegawa

Masato Suzuki

Hideo Yoshizawa

Goro Katsuyama

Norio Suzuki

Masayoshi Suzuki

Masayuki Yamane

Yuji Saito

Masataka Mochizuki

Seiji Terazawa

Takashi Ono

Nobuyuki Taguchi

Keiichi Yano

Junji Yamabe

Takeroh Kurenuma

Hideo Ichikawa

Motoyuki Ono

Kenichi Washio

Atsushi Nakayama

Ken Kimura

Koichi Mashiko

Eichi Osato

Yoshiei Hasegawa

Yoshihide Kawamura

Katsuya Hirano

Yusuke Uchida

Shuichi Yokohama

Hiroshi Susaki

Yuichi Ochiai

Fumie Satoh

Teruo Hitosugi

Takashi Hisazumi

Tatsushi Umayahara

Yumi Nakamoto

Naoto Ozaki

Teruo Shibata

Kaori Ozeki

Toru Hosokami

Tatsuya Nishi

Masakatsu Nagata

Katsuyuki Kakizaki

Eiichi Masushio

Ryoko Kitazawa

Takayuki Tamaki

Seiji Terasawa

A compound of the general formula (I): [wherein, Rrepresents a halogen atom, or the like, Rrepresents a hydrogen atom, or the like, Rand R, each independently, represent a hydrogen atom, a Calkyl group, or the like, Rrepresents a hydrogen atom, a halogen atom, or the like, Rrepresents a hydrogen atom, a halogen atom, or the like, Rand R, each independently, represent a hydrogen atom, a halogen atom, or the like, Rand R, each independently, represent a hydrogen atom, a Calkyl group, Rand R, each independently, represent a hydrogen atom, a Calkyl group, or the like, X represents an oxygen atom, a group &#x2014;CH&#x2014;, or the like, Y represents a nitrogen atom, a group &#x2550;CH&#x2014;, or the like, and Z represents a nitrogen atom, or the like] or a pharmacologically acceptable salt thereof, which has an excellent suppressive action on platelet aggregation, and is useful for prevention and/or treatment of thromboembolism.

3-(biaryloxy)propionic acid derivatives for prevention and/or treatment of thromboembolic diseases

The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container.

Electronic apparatus storing container and method for assembling electronic apparatus storing container

An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled.

Electrical connecting apparatus and testing system using the same

A contact according to the present invention comprises a plate-shaped first plunger contacting one member, a plate-shaped second plunger contacting the other member in a state of being overlapped with the first plunger and conducting electricity between the one member and the other member in cooperation with the first plunger, and a compression coil spring which is a member coupling the first plunger with the second plunger in a state where contact pieces thereof are in opposite directions from each other, covering outer circumferences of coupling portions of the first plunger and the second plunger, abutting on spring receiving portions of the respective plungers, and supporting the respective plungers to be relatively slidable. In an electrical connecting apparatus, the contacts are incorporated.

Contact and electrical connecting apparatus

An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit.

Testing apparatus for integrated circuit

The present invention provides an inexpensive semiconductor chip module enabling sufficient heat dissipation without complicating the manufacture process. A semiconductor chip module according to the present invention includes a plurality of semiconductor chips to be stacked provided at the side face with a connection terminal to be coupled with a circuit pattern formed on the front face, interlayer wiring mutually connecting the connection terminals on the side faces of the respective semiconductor chips by a wiring pattern, and a formation space contributing to heat dissipation, formed between at least some layers of the semiconductor chips, to secure a formation face of the interlayer wiring.

Stacked package and method for forming stacked package

A probe assembly having a plurality of probes, each of which is secured to an anchor portion on a probe base plate, extends in a direction apart from the anchor portion through a fulcrum, has a tip at the front end thereof, and the tip is elastically deformable at its front end side when pressed against a corresponding electrode pad. Two probe groups are constituted: in the first group, the tips are arranged on one side of an imaginary straight line of the probe base plate, while in the second probe group, the tips are arranged on the other side of the imaginary straight line. The numbers of the probes of both probe groups are different, and a part of the probes forming one probe group with more probes are arranged in the opposite direction to that of the other probes of the same probe group.

Probe assembly

A device for cooling a personal computer including: a body having a heat generating electronic element therein; and a keyboard section connected in an openable manner to the personal computer body through a hinge. A first heat pipe, which has its one end portion connected to the electronic element in a heat transferring manner, and a second heat pipe, which has its one end portion arranged along an electromagnetic insulating plate mounted in the keyboard section, are connected through the hinge in a manner to rotate relative to each other and in a heat transferring manner.

Personal computer cooling device having hinged heat pipe

A heat pipe for transferring heat as the latent heat of evaporation to a radiating portion at a lower temperature by heating a heating portion of a container to evaporate a working fluid and by conveying the produced vapor to the radiating portion thereby to condense the vapor. The container is formed into a flattened hollow shape by: a flat heating portion; a radiating portion opposed at a distance to the heating portion and having a larger area than that of the heating portion; and side wall portions jointing the heating portion and the radiating portion to each other along the entire peripheral edge portions of the same.

Heat pipe and process for manufacturing the same

A compound represented by the following formula (I): ##STR1## wherein R.sub.1 represents a hydrogen atom, an alkyl group or a cyclic alkyl group;

Pyrrolo(2,1-B)thiazole derivatives

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Tokyo, Japan

Masashi Hasegawa