Tdk Corporation

Nestec S.a.

Toppan Printing Co., Ltd.

Masashi Gotoh

Jitsuo Kanazawa

Hajime Kuwajima

Syuichiro Yamamoto

Hiroshi Yamamoto

Kaoru Kawasaki

Hiroki Hara

Mutsuko Nakano

Yoshihiko Minachi

Kouji Tashiro

Kazuhiko Inoue

Ken Kikuchi

Toru Mizuno

Kenji Honda

Noriyuki Kawano

Yasuhide Yamashita

Masaru Uno

Naoto Tsukamoto

Kazutomo Imi

Takeshi Itoh

Takuo Kataho

Yoshihiro Onozeki

Sadaki Satoh

Koichiro Okazaki

Osamu Ohhata

Shintarou Koike

Minao Himeno

Tomohiko Aida

Takahiro Mori

Kenichi Kawabata

Takeshi Saitoh

Noriyuki Sasaki

Shuichiro Yamamoto

Shinichi Sakano

Nobuyuki Shimbo

Takashi Satoh

Takashi Terayama

Shunichi Kudo

Daiji Takeuchi

Mitsuaki Sugiyama

Toyoaki Naitoh

Yoshihiro Enda

This arcuate magnet piece includes: coupling side surfaces which are coupled with other adjacently joined arcuate magnet pieces; a curved inner peripheral surface; and a curved outer peripheral surface which faces the inner peripheral surface. The coupling side surfaces include tip surfaces which intersect, at prescribed angles, tangents to the direction of curvature of the outer peripheral surface. The coupling side surfaces are polarized such that, in cases when the gaps formed with the coupling side surfaces of the other arcuate magnet pieces are disposed so as to be substantially parallel, the magnetic poles of the other joined arcuate magnet pieces are different.

Arcuate magnet piece, permanent magnet piece, permanent magnet assembly, permanent magnet application device, and motor

A lens holding unit is held so that it can relatively move with respect to a base part to a direction vertical to an optical axis direction. The lens holding unit has a lens holder, a magnet part, and a spring. The lens holder has a first coil. The magnet part has a first magnet part which includes a first face facing to the first coil and a second magnet part which includes a second face vertical to the first face and constitutes a magnetic domain different from that of the first magnet part. These first magnet part and second magnet part are integrated.

Lens holding device

A lens holding device includes a movable part having a coil attached to a lens holder holding a lens and includes a magnet part arranged around an outer peripheral side of the movable part so as to face the coil. The lens holding device includes a support part which supports the movable part so as to move relatively and a spring which connects the movable part and the support part resiliently. The magnet part includes a resin and has an alignment part which positions the spring.

Lens holding device for camera module

An injection molding composition includes a ferrite powder which is a collection of ferrite particles, a first binder and a second binder, wherein a softening point of the second binder is lower than that of the first binder, a weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb1, Wb2, and Db1, Db2, and a hypothetical thickness Tb1 of the first binder is 0.6 to 3.0, and a hypothetical thickness Tb2 of the second binder is 5.0 to 16.0. In the composition, it is preferable that coated ferrite particles covering the outer circumference of the ferrite particles with the first binder and the second binder exist.1 [nm]=(1&#xd7;10)/(1&#xd7;)&#x2003;&#x2003;formula (1)2 [nm]=(2&#xd7;10)/(2&#xd7;)&#x2003;&#x2003;formula (2).

Injection molding composition and producing method thereof

An injection molding composition, having a small fluctuation characteristic and a better characteristic, is provided. The above composition is the injection molding composition comprising a ferrite powder which is a collection of ferrite particles, a first binder and a second binder. A weight and a specific surface area of the ferrite powders are represented by Wp and S, and a weight and a density of the first binder and the second binder is represented by Wb, Wb, and Db, Db. A hypothetical thickness Tbof the first binder is 2.0 to 15.0, and a hypothetical thickness Tbof the second binder is 16.5 to 32.0. In the composition, it is preferable that coated ferrite particles coating the outer circumference of the ferrite particles with the first binder and the second binder exist.1 [nm]=(1&#xd7;10)/(1&#xd7;)&#x2003;&#x2003;formula (1)2 [nm]=(2&#xd7;10)/(2&#xd7;)&#x2003;&#x2003;formula (2)

The invention aims at providing a container for refill that enables transfer of the contents with one action and successfully secure the self-supporting property of the container for allowing the safe transfer. The opening portion (A) of body () of a cup-shaped container is provided internally with a hopper () tapering toward the opening portion (A). Ribs () are integrally provided between the outside of the hopper () and the inside of a ring (A) and arranged circumferentially at predetermined intervals. Height H from the top surface of the rib () to the opening (C) of hopper () is approximately a quarter or more of diameter &#x3c6; of the opening (C) of hopper (). A lid () tearable by pressing is attached to the opening portion (A) so as to enable the instant coffee P to be directly supplied through the mouth (A) of a refillable container () while being gathered to a central portion by the hopper () by inverting the container body () and pressing the lid () against the mouth (A) of container () to tear the lid ().

Container for refill

A method for producing a sintered magnet comprising steps of; wet-pulverizing a magnetic powder under the presence of a surface active agent, drying said wet-pulverized magnetic powderfor obtaining magnetic powder to which said surface active agent is adhered,

Method for producing sintered magnet

An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.

Method for manufacturing an electronic part

A lower punch is arranged to be inserted into a cavity of a die from a lower side of the die. A upper punch is arranged to be inserted into the cavity from an upper side of the die to compact the powder filled in the cavity, in cooperation with the lower punch. A feeder supplies the powder into the cavity. A first cam driving system has a first cam for vertically moving the die relative to the lower punch. A second cam driving system has a second cam for vertically moving the upper punch. A third cam driving system has a third cam for moving the feeder forward or backward relative to the cavity. A contact member is connected to the first cam driving system. A stopper is located above or below the contact member and regulates relative vertical movement of the die with respect to the lower punch, in cooperation with the contact member. A fourth cam driving system has a fourth cam for vertically moving the stopper. The first cam, the second cam, the third cam, and the fourth cam are rotated in synchronism.

Molding apparatus

The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.

Method of manufacturing electronic part and electronic part

A conductor portion is formed on the surface of a support member. After the conductor portion is formed, a copper foil on which resin is attached is moved downward from above the conductor portion to pressurize the conductor portion while covering it. the copper foil with the resin is pressed to the height of the conductor potion while using the conductor portion as a stopper. Thus, it is possible to make the height of the insulating layer equal to the height of the conductor portion.

Electronic part producing method and electronic part

A molding die unit has a shell and a die. The die is located inside the shell. A die hole is formed in the die. The die has first and second portions. The first and second portions include their respective surfaces defining the die hole and facing each other. A first through hole is formed in the shell and penetrates so as to open in an outside surface and in an inside surface of the shell. A second through hole continuing to the first through hole is formed at a position corresponding to the first through hole and in the first portion. The second through hole includes a first region and a second region. The first region opens in a surface of the first portion facing the inside surface of the shell and has a first sectional area. The second region opens in the surface defining the die hole and has a second sectional area smaller than the first sectional area.

Molding die unit

To fill a conductive material in an opening portion formed in a base of an electronic component, a groove is formed to surround an opening in an upper conductor, and the upper conductor is divided into a first conductive portion and a second conductive portion surrounding the first conductive portion. A mask is formed such that a conductor to be filled in the opening portion may not contact the second conductive portion. Metal plate is grown from the side of a lower conductor in the opening portion by using the lower conductor as electrode to fill the opening portion with metal plate. The metal plate filled in the opening portion and the upper conductor are joined by plating by using the upper conductor or the lower conductor as electrode.

Substrate, electronic component, and manufacturing method of these

In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.

Method of manufacturing laminated substrate

A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.

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Tokyo, Japan

Masashi Gotoh