Advanced Mobile Telecommunication Technology Inc.

Masashi Fuse

Hiroki Hoshizaki

Mounting structure for semiconductor device

Plural units each composed of a metallic frame and a dielectric substrate mounted on the frame are stacked on one another, thereby forming a unitary case. A superconducting circuit such as a resonator is formed on an upper surface of the substrate, and a ground plane, made of a metallic material, preferably, a superconducting material, is formed on a lower surface of the substrate. The ground plane is exposed to a center opening of the frame, so that the ground plane of one substrate faces the superconducting circuit of another substrate which is stacked underneath the one substrate with a space therebetween. Thus, a plurality of the superconducting circuits are mounted in a compact unitary case.

Growing community of inventors

Nisshin, Japan

Masashi Fuse