Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Masashi Funakoshi

Masaki Utsumi

Tsuyoshi Hamatani

Takeshi Morikawa

Yukio Nakabayashi

Toshifumi Ogata

Masumi Abe

Kosuke Takehara

Keiji Kiba

Kenji Ueda

A light emitting device includes: a substrate; one or more LED (light emitting diode) elements mounted on a substrate; and a radiator unit made of metal paste and arranged on a rear surface opposite to a principal surface on which the one or more LED elements are mounted. The height Ta of the radiator unit from a rear surface is less than thickness Tb of substrate.

Light emitting device and lighting apparatus

A light-emitting device includes a substrate, first LEDs and second LEDs mounted on the substrate, multiple wirings separately formed on the substrate, and a conductive member for connecting adjacent two wirings in multiple wirings for establishing series connection, parallel connection, or a combination of series and parallel connections of the first LEDs and the second LEDs. This achieves the light-emitting device that can support multiple different specifications, using a single type of substrate.

Light-emitting device and lighting apparatus using the same

A semiconductor device of the invention includes a semiconductor element (), an interposer () having electrodes () arranged on a top face thereof in four directions and external electrodes () arranged on a bottom face thereof with the semiconductor element () mounted on the top face thereof, an adhesive material () fixing the semiconductor element () to the interposer (), metal nanowires () electrically connecting between electrodes of the semiconductor element () and the electrodes () of the interposer (), an insulating material () sealing a region containing the semiconductor element () and the metal nanowires (), and metal balls () mounted on the external electrodes (). Patterns () are designed on corners of a region surrounded by electrodes () arranged on the interposer () in four directions.

Semiconductor device and manufacturing method thereof

A lead frame includes: an outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections; connecting sections for connecting and supporting the lead sections and the outer frame section with each other; and an encapsulation region in which the chip mounting sections are encapsulated together in an encapsulation resin. An opening is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region and along the extension of one of the connecting sections.

Lead frame and method for fabricating resin-encapsulated semiconductor device using the same

Growing community of inventors

Osaka, Japan

Masashi Funakoshi