Tokyo Electron Limited

Masashi Enomoto

Masahide Tadokoro

Shinichiro Kawakami

Takashi Yamauchi

Toyohisa Tsuruda

Teruhiko Kodama

Hiroshi Nakamura

Taro Yamamoto

Michael Carcasi

Masahiro Fukuda

Satoru Shimura

Akihiro Kubo

Yohei Sano

Kenji Yada

Takahiro Shiozawa

Noboru Nakashima

Mark H Somervell

Hidetami Yaegashi

Junichi Kitano

Hideharu Kyouda

Joshua Hooge

Hisashi Kawano

Hitoshi Kosugi

Hidefumi Matsui

Masato Hosaka

Joel Estrella

Yuichiro Kunugimoto

Hiroyuki Iwaki

Yoshihiro Kondo

Kentaro Yamamura

Soichiro Okada

Keisuke Yoshida

Hiroshi Mizunoura

Naoto Nakamura

Satoshi Itoh

Masashi Imanaka

Kouichi Hontake

Toshiyuki Fukumoto

Tomoya Onitsuka

Hideaki Kashiwagi

Koichi Hontake

Hirokazu Kyokane

Masahiro Yanagisawa

Kazuhiro Shiba

Takafumi Hashimoto

A technique for suppressing a metal component from remaining at a bottom of a mask pattern when the mask pattern is formed using a metal-containing resist film. A developable anti reflection filmis previously formed below a resist film. Further, after exposing and developing the wafer W, TMAH is supplied to the wafer W to remove a surface of the anti-reflection filmfacing a bottom of the recess patternof the resist film. Therefore, the metal componentcan be suppressed from remaining at the bottom of the recess pattern. Therefore, when the SiOfilmis subsequently etched using the pattern of the resist film, the etching is not hindered, so that defects such as bridges can be suppressed.

Substrate processing module

A substrate processing apparatus includes: an imaging portion configured to acquire a surface image of a film formed on a surface of a substrate; an optical property estimation portion configured to estimate an optical property of the film based on process information acquired during formation of the film; and a film thickness estimation portion configured to estimate a film thickness of the film based on the surface image and an estimation result of the optical property.

Substrate processing apparatus, substrate processing method, and storage medium

An apparatus includes: an capturing part that captures a peripheral edge portion of a substrate including a reference substrate and a workpiece substrate, so as to acquire captured images of the reference and workpiece substrates; a first calculation part that calculates a theoretical peripheral edge position of the reference substrate in the captured image of the reference substrate with reference to a center thereof; a second calculation part that calculates a theoretical peripheral edge position of the workpiece substrate in the captured image of the workpiece substrate based on the theoretical peripheral edge position of the reference substrate and the captured image of the workpiece substrate; a setting part that sets processing parameters for the peripheral edge portion of the substrate based on the theoretical peripheral edge position of the workpiece substrate; and a processing part that processes the peripheral edge portion of the substrate based on the processing parameters.

Peripheral edge processing apparatus, peripheral edge processing method, and computer-readable recording medium

An information processing apparatus includes a prediction unit configured to calculate, based on a film thickness model representing a relationship between a state of a substrate processing apparatus and a film thickness of a coating film formed on a front surface of a substrate by the substrate processing apparatus and pre-data representing the state of the substrate processing apparatus before the substrate is processed by the substrate processing apparatus, a predicted film thickness when the substrate is processed by the substrate processing apparatus; and an output unit configured to output, based on the predicted film thickness, instruction information on a processing of the substrate before the substrate is processed by the substrate processing apparatus.

Information processing apparatus, information processing method and computer-readable recording medium

A substrate treatment method of treating a treatment object substrate includes before applying a resist solution for forming a resist film onto a base film formed on a substrate surface of the treatment object substrate, making a determination of which one of a first treatment and a second treatment to perform based on the treatment object substrate. In response to the determination determining to perform the first treatment, performing the first treatment of decreasing a polarity of the base film to bring it closer to a polarity of the resist solution. In response to the determination determining to perform the second treatment, performing a treatment of increasing the polarity of the base film to bring it closer to the polarity of the resist solution.

Substrate treatment method and substrate treatment system

A substrate inspection device for inspecting a substrate, includes: a setting part configured to define a group according to a basic state that is not dependent on a presence or absence of a defect in a substrate and set the defined group for each inspection target substrate; an inspection part configured to perform a defect inspection based on a captured image of the inspection target substrate and an inspection recipe corresponding to the defined group to which the inspection target substrate belongs and including a reference image; a recipe creation part configured to create the inspection recipe for each group; and a determination part configured to perform a determination as to whether a group-setting target substrate, for which the group is set by the setting part, belongs to the group defined by the setting part.

Substrate inspection device, substrate inspection method, and storage medium

Various embodiments of systems and methods for monitoring thermal characteristics of substrates, substrate processes and/or substrate processing module components are disclosed herein. More specifically, the present disclosure provides various embodiments of a thermal imaging sensor within various substrate processing modules (e.g., a liquid dispense module, a baking module or combined bake module, an interface block, a wafer inspection system (WIS) module, a plating dispense module or another processing module) of a substrate processing system. By positioning the thermal imaging sensor at various locations within the substrate processing system, the present disclosure enables thermal data to be remotely collected from the substrate surface, a liquid dispensed onto the substrate surface, a processing space surrounding the substrate, or a component included within a substrate processing module (e.g., a liquid dispense nozzle, a spin chuck, a spin coat cup, a cooling arm, a WIS component, a heating component, etc.).

Thermal imaging sensor for integration into track system

A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.

Substrate processing apparatus, estimation method of substrate processing and recording medium

Method for forming mask pattern, storage medium, and apparatus for processing substrate

A substrate treatment method includes: generating, for each of layers constituting a stacked film on a substrate, a captured image of the substrate after a treatment regarding a relevant layer; and acquiring information indicating a feature amount estimated based on the captured image for each of a plurality of layers including an outermost layer of the stacked film on the substrate.

A substrate processing apparatus which processes includes a thermal processor that performs thermal processing on the substrate; an imager that images the substrate; and a controller that executes adjustment processing of adjusting conditions of processing on the substrate. The adjustment processing includes: controlling the imager to image an unexposed adjustment substrate on which a resist film is formed; controlling the thermal processor to perform the thermal processing on the adjustment substrate subjected to uniform exposure processing of exposing each region of a substrate surface with a fixed exposure amount after the pre-exposure imaging; controlling the imager to image the adjustment substrate after the thermal processing; estimating an in-plane temperature distribution of the adjustment substrate in the thermal processing based on the pre-exposure imaging result and the post-heating imaging result; and deciding processing conditions of the thermal processing based on an estimation result of the in-plane temperature distribution.

Substrate processing apparatus and processing condition adjustment method

Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

Systems and methods for spin process video analysis during substrate processing

A substrate processing method includes: forming a coating film on a substrate by supplying a resist liquid which is photosensitive to extreme ultraviolet (EUV) light to a surface of the substrate; forming a semi-solidified film by volatilizing a solvent contained in the coating film without heating the solvent; irradiating the semi-solidified film with EUV light thereby exposing the semi-solidified film with EUV light; and supplying a developer to the substrate after the exposure of the semi-solidified film.

Substrate processing method, substrate processing apparatus, and computer readable recording medium

A substrate processing method is a method of processing a substrate on which a metal-containing liquid for a film below a resist is applied, wherein prior to a heating process of performing a heat treatment on the substrate applied with the metal-containing liquid, the substrate processing method includes: a deprotection promoting process of promoting deprotection of functional groups in a material for the film included in the substrate on which the metal-containing liquid has been applied; a solvent removing process of removing a solvent included in the metal-containing liquid on the substrate; and a moisture absorbing process of bringing a surface of the substrate into contact with moisture.

Substrate processing method and substrate processing apparatus

Growing community of inventors

Koshi, Japan

Masashi Enomoto