Denso Corporation

Nippondenso Co., Ltd.

Masashi Echigo

Tadao Suzuki

Toshitaka Yamada

Kaoru Nomoto

Hiroyuki Yamakawa

Masayuki Aoyama

Takushi Maeda

Masahiko Kitano

Yoshitaka Nagayama

A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25&deg; C., and an Izod impact strength of approximately 1 kgf&middot;cm/cm or more at 25&deg; C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of &minus;100&deg; C. to &minus;50&deg; C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0&deg; C. to 100&deg; C. by &bgr;&prime; relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.

Shock-resistive printed circuit board and electronic device including the same

In a method of producing a resin-sealed electronic device, a solder resist layer including a silicone family surfactant is coated on a printed circuit board. Thereafter, an electronic component is mounted on the solder resist layer through adhesives, and is sealed by sealing resin. The content of the silicone family surfactant in the solder resist layer is less than 3 wt %, more preferably, is in a range of 0.2 wt % to 1 wt %. Accordingly, adhering reliability of the sealing resin relative to the solder resist can be improved, thereby resulting in high reliability of the resin-sealed electronic device for a long time.

Method of producing resin-sealed electronic device

In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.

Semiconductor device for sensing strain on a substrate

Growing community of inventors

Kariya, Japan

Masashi Echigo