Kitz Corporation

Shinko Electric Industries Co., Ltd.

Masaru Yamazaki

Kazuhito Kurose

Tomoyuki Ozasa

Hisanori Terui

Teruhiko Horigome

Koichi Hagiwara

Hidenobu Tameda

Hideki Kotsuji

Mitsuhide Hirabayashi

Kozo Ito

Masao Nakazawa

Kei Imafuji

Tadashi Kodaira

Takahiro Rokugawa

Masaki Sanada

Kazuhiko Ooi

Takaaki Yazawa

Sachiko Oda

Yukihiro Hirata

Toshiaki Suyama

Kinji Nagata

Kenjiro Enoki

Makoto Kawahara

Yoshihiro Hirata

Yukiji Watanabe

By enhancing a stress corrosion cracking resistance in a leadless brass alloy, specifically by suppressing a velocity of propagation of corrosion cracks in the brass alloy, a straight line crack peculiar to the leadless brass alloy is suppressed, a probability of cracks coming into contact with &#x3b3; phases is heightened and local corrosion on the brass surface is prevented to suppress induction of cracks by the local corrosion, thereby providing a leadless brass alloy contributable to enhancement of the stress corrosion cracking resistance. The present invention is directed to an Sn-containing Bi-based, Sn-containing Bi+Sb-based or Sn-containing Bi+Se+Sb-based leadless brass alloy excellent in stress corrosion cracking resistance, having an &#x3b1;+&#x3b3; structure or &#x3b1;+&#x3b2;+&#x3b3; structure and having &#x3b3; phases distributed uniformly therein at a predetermined proportion to suppress local corrosion and induction of stress corrosion cracks.

Leadless brass alloy excellent in stress corrosion cracking resistance

A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Solder bump forming method

A substrate transfer apparatus has pluralities of pairs of substrate support mechanisms. The substrate support mechanism includes a first roller provided on a first rotary shaft and a second roller provided on a second rotary shaft, the substrate support mechanism transfers a substrate in a transfer direction while supporting the substrate between the first and second rollers in a thickness direction of the substrate. The pair of the substrate support mechanisms are disposed so as to oppose to each other in a width direction of the substrate and the pairs of the substrate support mechanisms are arranged along with the transfer direction. Further, a substrate position regulating member that regulates a position of the substrate by contacting with a side surface which is parallel to the transfer direction is provided on either of the first and second rotary shafts.

Substrate transfer apparatus

Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.

Brass

A metal core substrate comprises a core layer ( ) consisting of first and second metal plates ( ) layered with a third insulating layer ( ) interposed therebetween; first and second insulating layers ( ) formed on the first and metal plates, respectively; first and second wiring patterns ( ) formed on the first and second insulating layers, respectively. A conductive layer ( ) formed in a through-hole ( ) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate ( ) is electrically connected with the first wiring pattern ( ) and the second wiring pattern ( ), respectively, by means of a via ( ) and by means a via ( ). The second metal plate ( ) is electrically connected with the second wiring pattern ( ) and the first wiring pattern ( ), respectively, by means of a via ( ) and by means a via ( ), respectively.

Metal core substrate and process for manufacturing same

A copper-based alloy includes one base phase selected from the group consisting of &agr; phase, &agr;&plus;&bgr; phase, and &agr;&plus;&bgr;&plus;&ggr; phase, a component having a lower melting point than the base phase, and a component for dispersing the base phase and the low melting component to uniformly disperse the low melting component and improve the copper-based alloy in machinability. A method for producing the copper alloy in the form of a bar or plate includes the steps of compounding raw materials in predetermined ratios thereby obtaining a mixture, fusing the mixture thereby obtaining a melt, continuously casting the melt into a cast billet, or rolling the cast billet thereby obtaining a shaped mass, heat-treating the shaped mass, drawing or rolling the heat-treated shaped mass thereby obtaining a plastic mass, and subjecting the plastic mass to a heat-treatment of air cooling or furnace cooling.

Copper-based alloy, method for production of the alloy, and products using the alloy

Growing community of inventors

Nagano, Japan

Masaru Yamazaki