Renesas Technology Corp.

Masaru Yamada

Hiromichi Suzuki

Toshiaki Ishii

Fujio Ito

Takafumi Nishita

Ryozo Takeuchi

Junpei Kusukawa

Akihiko Kameoka

At least a part of the inner leads of a lead frame is covered with a plating for a metallic fine wire connection, at least the entire portion where the lead frame joins with the adhesive layer is covered by at least one metal or alloy thereof different from the metallic fine wire connecting use plating. The metal or alloy is selected from the group consisting of gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium and zirconium. Thereby, generation of defects, such as leakage and shorting, due to ion migration can be prevented.

Semiconductor device

Growing community of inventors

Kodaira, Japan

Masaru Yamada