Murata Manufacturing Co., Ltd.

Masaru Takahashi

Takuji Nakagawa

Yoshikazu Takagi

Akira Nakamura

Kazuo Hattori

Isamu Fujimoto

Nobuyasu Hamamori

Choichiro Fujii

Hideki Nakayama

Masayoshi Miyazaki

Hirobumi Adachi

Hiroshi Asano

Tadateru Yamada

Noriyuki Ookawa

Yuichiro Morimoto

Daisho Tsubokawa

Toshiyuki Nakamura

In a three-terminal multilayer ceramic capacitor, each of first through fourth external electrodes includes a base electrode layer including a conductive metal and a glass component, an organic layer including an organosilicon compound covering the base electrode layer, and a plating layer on the organic layer. On a surface of the organic layer in a portion facing the plating layer, an atomic concentration ratio of Si to Cu is greater than or equal to about 1.5% and less than or equal to about 5.5%, or greater than or equal to about 0.8% and less than or equal to about 2.8%, and a surface roughness is greater than or equal to about 0.334 and less than or equal to about 0.371, or greater than or equal to about 0.352 and less than or equal to about 0.395.

Three-terminal multilayer ceramic capacitor

A multilayer ceramic capacitor satisfies a relationship A&#x3e;B, where B represents a coverage rate of a first organic layer disposed on a first base electrode layer located on a first end surface, A represents a coverage rate of the first organic layer disposed on the first base electrode layer located on a first main surface or a second main surface, and A represents a coverage rate of the first organic layer located on the first main surface or the second main surface. A second end surface also has a similar configuration.

Multilayer ceramic electronic component including organic layers having different coverage rates and mount structure therefor

A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer.

Mounting structure and multilayer capacitor built-in substrate

An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

Electronic component containing substrate

A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

Built-in-electronic-component substrate and manufacturing method therefor

A mounted structure includes a laminated capacitor, a wiring substrate, and a joint material. The laminated capacitor includes a body with dielectric layers and internal electrode layers alternately stacked, and an external electrode connected to the internal electrode layers. The body includes a side surface coated with a side surface coating portion of the external electrode. The joint material is joined to the side surface coating portion and a land provided on the wiring substrate so as to cover the outer surfaces thereof. The outer end portion of the thickest portion of the joint material covering the side surface coating portion is located farther outside an outer end of the land in a direction perpendicular or substantially perpendicular to a side surface of the body.

Laminated capacitor mounted structure

A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Ceramic electronic part and method for producing the same

A projection,is formed on a connecting terminal part,opposing to a side surface,of a ceramic electronic component main body,in a terminal member,by processing the metal plate which provides this terminal member,. This projection,is made to project toward the side surface,of the ceramic electronic component main body,. The interval more than the predetermined dimension is reliably formed between the connecting terminal part,and the side surface,of the ceramic electronic component main body,by the projection,. This prevents the solder from reaching even to the ceramic electronic component main body

Ceramic electronic component

A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a U shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

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Nagaokakyo, Japan

Masaru Takahashi