Tokyo Ohka Kogyo Co., Ltd.

Masaru Shida

Hiroshi Komano

Kiyoshi Uchikawa

Kunihiro Noda

Dai Shiota

Hiroki Chisaka

Junichi Onodera

Yasuaki Sugimoto

Teruhiro Uematsu

Hiroyuki Ohnishi

Isao Tateno

A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120&#xb0; C. to 350&#xb0; C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which Rrepresents a hydrogen atom or a hydroxyl group, Rand Rindependently represent a hydrogen atom or a Cto Calkyl group, and Rand Rindependently represent a Cto Calkyl group. 

Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution

A method for producing a polybenzoxazole resin, in which even when a polybenzoxazole precursor is heat treated at a low temperature, a polybenzoxazole resin that is excellent in mechanical properties, such as tensile elongation, and in chemical resistance, is suppressed in terms of coloration, and is high in transparency can be produced. A polybenzoxazole resin is formed by heating a polybenzoxazole precursor which is obtained by allowing an aromatic diaminediol and a diformyl compound or a dicarboxylic acid dihalide, to react with each other in a solvent containing an amide compound or a urea compound each having a specified structure, at 120&#xb0; C. to 350&#xb0; C.

Method for producing polybenzoxazole resin

A positive photosensitive resin composition with favorable heat resistance and transparency is provided. The photosensitive resin composition contains a resin component (A1) having a structural unit (a1') obtained by substituting at least a portion of hydrogen atoms of phenolic hydroxyl groups within a structural unit represented by a general formula (a1) shown below with a naphthoquinone-1,2-diazide-5-(and/or -4-) sulfonyl group. (In the above general formula, Rrepresents a hydrogen atom or methyl group, Rrepresents a single bond or an alkylene group of 1 to 5 carbon atoms, Rrepresents an alkyl group of 1 to 5 carbon atoms, a represents an integer from 1 to 5, b represents either 0 or an integer from 1 to 4, and a+b is no greater than 5. If two or more Rgroups exist, then these Rgroups may be either the same or mutually different.)

Photosensitive resin composition and color filter

The present invention provides a photopolymerizable composition for a color filter containing an addition-polymerizable compound having at least one ethylenically unsaturated double bond, a photopolymerization initiator and the oxide of at least one metal selected from the group consisting of Cu, Fe, Mn, Cr, Co, Ni and Al and being substantially free from any halogen atom; and a process for producing a color filter. The photopolymerizable compositions for a color filter makes it possible to form a color filter having good heat resistance and high electrical insulation resistance and have high storage stability.

Photopolymerizable composition for color filter

Process for producing color filter

A photosensitive resin composition for forming light shielding films comprising a mixture of; 10 to 60 parts by weight of a high molecular weight polymeric binder; 15 to 50 parts by weight of a photopolymerizable monomer; 0.1 to 30 parts by weight of a photopolymerization initiator; and at least 20 parts by weight of a light shielding pigment comprising carbon black coated with resin for forming black matrices such as CRT displays and liquid crystal panels; a black matrix made from by said photosensitive resin composition; and a method for producing said black matrix comprising the steps of coating said photosensitive resin composition comprising a high molecular weight polymeric binder, a photopolymerizable monomer, a photopolymerization initiator, and a light shielding pigment consisting of carbon black coated with resin on a substrate, selectively radiating an activated beam, and developing the coating using an alkaline aqueous solution to form a pattern. The blackmatrix maintains high image contrast, and excels in electric insulation.

Photosensitive resin composition for forming light shielding films,

A photosensitive resin composition for forming light shielding films is of particular utility in forming a black matrix for use in display elements such as of a CRT display, a liquid crystal panel, a plasma display and the like. The photosensitive resin composition is comprised of a photopolymerizable compound, a photopolymerization initiator, and light shielding materials composed of an oxide of copper and an oxide or oxides of at least one metal selected from iron, manganese, chromium, cobalt and nickel. The black matrix so obtained is conducive to high heat resistance, greatly light shielding and sharp image contrast as well as to excellent electrical insulation resistance. For use in the plasma display in particular, a black matrix is producible by coating of the photosensitive resin composition on a given substrate, followed by exposure of the coat to selective irradiation with active light rays to form a pattern therein and by subsequently burning of the pattern.

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Kawasaki, Japan

Masaru Shida