Jsr Corporation

The Furukawa Electric Co., Ltd.

The University of Arizona

Consejo Superior De Investigaciones Cientificas

Toyo Ink Manufacturing Company

Toyo Ink Mfg. Co., Ltd.

Masaru Ohta

Osamu Kato

Katsumi Inomata

Masaaki Matsuo

Atsushi Ito

Shin-ichiro Iwanaga

Hozumi Sato

Toshiyuki Ota

Isamu Mochizuki

Jian-Kang Zhu

Shinichiro Iwanaga

Kimiyasu Sano

Yan Peng Guo

Masujiro Sumita

Isao Hosoi

Keiji Komori

Hirohumi Aoki

Changqing Zhang

Karen Sue Schumaker

Quansheng Qiu

Jose Manuel Pardo-Prieto

Francisco Javier Quintero-Toscano

A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.

Method for forming bump on electrode pad with use of double-layered film

The present invention provides a method of increasing salt tolerance in a plant by overexpressing a gene encoding a mutant SOS2 protein in at least one cell type in the plant. The present invention also provides for transgenic plants expressing the mutant SOS2 proteins.

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The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of:

Two-layer film and method of forming pattern with the same

There is disclosed a resin-coated metal sheet for a part of electronic machinery and tools, which is a metal sheet coated with a resin on the surface, wherein a resin layer is composed of one or more resin selected from polyester-series, epoxy-series, phenol-series and alkyd-series resins, the resin layer has a 0.1 to 10 &#x3bc;m thickness, and the resin layer contains 2 to 60 parts by weight of nickel with 0.1 to 100 &#x3bc;m of an average value in terms of maximum longer diameters, to 100 parts by weight of the resin. The resin-coated aluminum sheet is excellent in anti-fingerprint property and formability, as well as excellent in electric characteristics.

Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof

There is disclosed a resin-coated metal sheet for a part of electronic machinery and tools, which is a metal sheet coated with a resin on the surface, wherein a resin layer is composed of one or more resin selected from polyester-series, epoxy-series, phenol-series and alkyd-series resins, the resin layer has a 0.1 to 10 &mgr;m thickness, and the resin layer contains 2 to 60 parts by weight of nickel with 0.1 to 100 &mgr;m of an average value in terms of maximum longer diameters, to 100 parts by weight of the resin. The resin-coated aluminum sheet is excellent in anti-fingerprint property and formability, as well as excellent in electric characteristics.

A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

Positive photoresist composition

A method of forming an image which comprises subjecting an image-forming material comprised of a substrate and a photosensitive layer containing a dye and/or a pigment and a photopolymerizable compound and disposed on the substrate to an image-exposure, thereby to allow the exposure to cause a difference of adhesion between an exposed portion and non-exposed portion in the photosensitive layer, and transferring the image to an image receptor on the basis of the difference of adhesion; wherein the photosensitive layer of the exposed image-forming material and the image receptor are allowed to face each other and directed into the nip between two rollers consisting of an elastic roller and a metallic roller having a surface temperature of between 50.degree. C. and 150.degree. C. with the image-forming material in contact with the elastic roller, thereby to transfer the image formed on the photosensitive layer to the image receptor through a nip portion of the two rollers, and the image-forming material and the image receptor are separated in a warm state after passage of these two members through the nip portion.

Method of image formation using heated rollers

In the negative form of lith type film or photographic printing paper, the ground part is light-untransmissible and image part (letter, pattern) is light-transmissible. Apart from them, pinholes and stains also constitute light-transmissible areas. Although the light-transmissible areas of letter and pattern are necessary, the light-transmissible areas of pinhole and stain are unnecessary. Thus, the unnecessary light-transmissible areas must be distinguished from the necessary light-transmissible areas, and an opaque layer must be provided on the unnecessary areas to make them opaque. Generally, however, the unnecessary light-transmissible areas are minute and many in number, so that their detection and opaquing is a very laborious work. Thus, according to the opaquing method of the present invention, only the necessary light-transmissible area is detected and the other light-transmissible areas are regarded as unnecessary and the latter are stopped out. Otherwise, unnecessary light-transmissible areas are detected, and they are stopped out. The opaquing apparatus of the invention is equipped with a means for exposing a lith type film or a photographic printing paper to light, a means for detecting necessary light-transmissible area, and a means for providing an opaque layer on the unnecessary light-transmissible areas detected by the detecting means.

Opaquing method and apparatus thereof

Growing community of inventors

Tokyo, Japan

Masaru Ohta